How severe is CVE-2015-9190?

CVE-2015-9190 has a CVSS 3.x base score of 9.8, rated critical severity. It is exploitable over network with low attack complexity, requires no privileges and no user interaction. Impact on confidentiality is high, integrity high, and availability high.

Is CVE-2015-9190 being actively exploited?

It is not currently listed in CISA's KEV catalog. Its EPSS exploit-prediction score is 1% (66th percentile), an estimate of the probability of exploitation in the next 30 days.

What products are affected by CVE-2015-9190?

CVE-2015-9190 primarily affects Qualcomm Mdm9206 Firmware. In total, 19 product configurations (CPEs) are listed as vulnerable; see the affected-products list for the exact versions.

How do I fix CVE-2015-9190?

Review the linked vendor and NVD advisories for patched versions and mitigations, then upgrade or apply the recommended workaround. Given its critical severity, prioritise patching exposed systems.

When was CVE-2015-9190 published?

CVE-2015-9190 was published on 2018-04-18 and last updated on 2026-06-17.

CVE-2015-9190

CVE-2015-9190 is a critical-severity vulnerability in Qualcomm Mdm9206 Firmware with a CVSS 3.x base score of 9.8. It is not currently listed as actively exploited by CISA, and its EPSS exploit-prediction score is low. The underlying weakness is classified as CWE-190.

Key facts

Severity: Critical (CVSS 3.x base score 9.8)
CVSS v2: 10.0
EPSS exploit prediction: 1% (66th percentile)
Actively exploited: Not listed in CISA KEV
Weakness: CWE-190
Affected product: Qualcomm Mdm9206 Firmware
Published: 2018-04-18
Last modified: 2026-06-17

Description

In Android before 2018-04-05 or earlier security patch level on Qualcomm Snapdragon Mobile and Snapdragon Wear IPQ4019, MDM9206, MDM9607, MDM9615, MDM9625, MDM9635M, MSM8909W, SD 210/SD 212/SD 205, SD 400, SD 410/12, SD 600, SD 615/16/SD 415, SD 808, and SD 810, if start_addr + size is too large in boot_clobber_check_local_address_range(), an integer overflow occurs, resulting in clobber protection check being bypassed and SBL memory corruption.

Frequently asked questions

What is CVE-2015-9190?: In Android before 2018-04-05 or earlier security patch level on Qualcomm Snapdragon Mobile and Snapdragon Wear IPQ4019, MDM9206, MDM9607, MDM9615, MDM9625, MDM9635M, MSM8909W, SD 210/SD 212/SD 205, SD 400, SD 410/12, SD 600, SD 615/16/SD 415, SD 808, and SD 810, if start_addr + size is too large in boot_clobber_check_local_address_range(), an integer overflow occurs, resulting in clobber protection check being bypassed and SBL memory corruption.
How severe is CVE-2015-9190?: CVE-2015-9190 has a CVSS 3.x base score of 9.8, rated critical severity. It is exploitable over network with low attack complexity, requires no privileges and no user interaction. Impact on confidentiality is high, integrity high, and availability high.
Is CVE-2015-9190 being actively exploited?: It is not currently listed in CISA's KEV catalog. Its EPSS exploit-prediction score is 1% (66th percentile), an estimate of the probability of exploitation in the next 30 days.
What products are affected by CVE-2015-9190?: CVE-2015-9190 primarily affects Qualcomm Mdm9206 Firmware. In total, 19 product configurations (CPEs) are listed as vulnerable; see the affected-products list for the exact versions.
How do I fix CVE-2015-9190?: Review the linked vendor and NVD advisories for patched versions and mitigations, then upgrade or apply the recommended workaround. Given its critical severity, prioritise patching exposed systems.
When was CVE-2015-9190 published?: CVE-2015-9190 was published on 2018-04-18 and last updated on 2026-06-17.

References

Affected products (19)

cpe:2.3:o:qualcomm:mdm9206_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:mdm9607_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:mdm9615_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:mdm9625_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:mdm9635m_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:ipq4019_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:msm8909w_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_210_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_212_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_205_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_400_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_410_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_412_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_600_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_615_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_616_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_415_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_808_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_810_firmware:-:*:*:*:*:*:*:*

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