How severe is CVE-2016-2063?

CVE-2016-2063 has a CVSS 3.x base score of 7.8, rated high severity. It is exploitable over local access with low attack complexity, requires low privileges and no user interaction. Impact on confidentiality is high, integrity high, and availability high.

Is CVE-2016-2063 being actively exploited?

It is not currently listed in CISA's KEV catalog. Its EPSS exploit-prediction score is 0% (37th percentile), an estimate of the probability of exploitation in the next 30 days.

What products are affected by CVE-2016-2063?

CVE-2016-2063 affects Linux Linux Kernel. See the affected-products list for the exact vulnerable versions.

How do I fix CVE-2016-2063?

Review the linked vendor and NVD advisories for patched versions and mitigations, then upgrade or apply the recommended workaround. Given its high severity, prioritise patching exposed systems.

When was CVE-2016-2063 published?

CVE-2016-2063 was published on 2016-08-07 and last updated on 2026-06-17.

CVE-2016-2063

CVE-2016-2063 is a high-severity vulnerability in Linux Linux Kernel with a CVSS 3.x base score of 7.8. It is not currently listed as actively exploited by CISA, and its EPSS exploit-prediction score is low. The underlying weakness is classified as CWE-119.

Key facts

Severity: High (CVSS 3.x base score 7.8)
CVSS v2: 4.6
EPSS exploit prediction: 0% (37th percentile)
Actively exploited: Not listed in CISA KEV
Weakness: CWE-119
Affected product: Linux Linux Kernel
Published: 2016-08-07
Last modified: 2026-06-17

Description

Stack-based buffer overflow in the supply_lm_input_write function in drivers/thermal/supply_lm_core.c in the MSM Thermal driver for the Linux kernel 3.x, as used in Qualcomm Innovation Center (QuIC) Android contributions for MSM devices and other products, allows attackers to cause a denial of service or possibly have unspecified other impact via a crafted application that sends a large amount of data through the debugfs interface.

Frequently asked questions

What is CVE-2016-2063?: Stack-based buffer overflow in the supply_lm_input_write function in drivers/thermal/supply_lm_core.c in the MSM Thermal driver for the Linux kernel 3.x, as used in Qualcomm Innovation Center (QuIC) Android contributions for MSM devices and other products, allows attackers to cause a denial of service or possibly have unspecified other impact via a crafted application that sends a large amount of data through the debugfs interface.
How severe is CVE-2016-2063?: CVE-2016-2063 has a CVSS 3.x base score of 7.8, rated high severity. It is exploitable over local access with low attack complexity, requires low privileges and no user interaction. Impact on confidentiality is high, integrity high, and availability high.
Is CVE-2016-2063 being actively exploited?: It is not currently listed in CISA's KEV catalog. Its EPSS exploit-prediction score is 0% (37th percentile), an estimate of the probability of exploitation in the next 30 days.
What products are affected by CVE-2016-2063?: CVE-2016-2063 affects Linux Linux Kernel. See the affected-products list for the exact vulnerable versions.
How do I fix CVE-2016-2063?: Review the linked vendor and NVD advisories for patched versions and mitigations, then upgrade or apply the recommended workaround. Given its high severity, prioritise patching exposed systems.
When was CVE-2016-2063 published?: CVE-2016-2063 was published on 2016-08-07 and last updated on 2026-06-17.

References

Affected products (1)

cpe:2.3:o:linux:linux_kernel:*:*:*:*:*:*:*:*

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