How severe is CVE-2017-18074?

CVE-2017-18074 has a CVSS 3.x base score of 9.8, rated critical severity. It is exploitable over network with low attack complexity, requires no privileges and no user interaction. Impact on confidentiality is high, integrity high, and availability high.

Is CVE-2017-18074 being actively exploited?

It is not currently listed in CISA's KEV catalog. Its EPSS exploit-prediction score is 1% (66th percentile), an estimate of the probability of exploitation in the next 30 days.

What products are affected by CVE-2017-18074?

CVE-2017-18074 primarily affects Qualcomm Mdm9607 Firmware. In total, 23 product configurations (CPEs) are listed as vulnerable; see the affected-products list for the exact versions.

How do I fix CVE-2017-18074?

Review the linked vendor and NVD advisories for patched versions and mitigations, then upgrade or apply the recommended workaround. Given its critical severity, prioritise patching exposed systems.

When was CVE-2017-18074 published?

CVE-2017-18074 was published on 2018-04-11 and last updated on 2026-06-17.

CVE-2017-18074

CVE-2017-18074 is a critical-severity vulnerability in Qualcomm Mdm9607 Firmware with a CVSS 3.x base score of 9.8. It is not currently listed as actively exploited by CISA, and its EPSS exploit-prediction score is low. The underlying weakness is classified as CWE-20.

Key facts

Severity: Critical (CVSS 3.x base score 9.8)
CVSS v2: 10.0
EPSS exploit prediction: 1% (66th percentile)
Actively exploited: Not listed in CISA KEV
Weakness: CWE-20
Affected product: Qualcomm Mdm9607 Firmware
Published: 2018-04-11
Last modified: 2026-06-17

Description

In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Mobile and Snapdragon Wear MDM9607, MDM9625, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, SD 210/SD 212/SD 205, SD 400, SD 410/12, SD 425, SD 430, SD 615/16/SD 415, SD 800, SD 808, SD 810, SD 820, SD 835, while playing a .wma file with modified media header with non-standard bytes per second parameter value, a reachable assert occurs.

Frequently asked questions

What is CVE-2017-18074?: In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Mobile and Snapdragon Wear MDM9607, MDM9625, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, SD 210/SD 212/SD 205, SD 400, SD 410/12, SD 425, SD 430, SD 615/16/SD 415, SD 800, SD 808, SD 810, SD 820, SD 835, while playing a .wma file with modified media header with non-standard bytes per second parameter value, a reachable assert occurs.
How severe is CVE-2017-18074?: CVE-2017-18074 has a CVSS 3.x base score of 9.8, rated critical severity. It is exploitable over network with low attack complexity, requires no privileges and no user interaction. Impact on confidentiality is high, integrity high, and availability high.
Is CVE-2017-18074 being actively exploited?: It is not currently listed in CISA's KEV catalog. Its EPSS exploit-prediction score is 1% (66th percentile), an estimate of the probability of exploitation in the next 30 days.
What products are affected by CVE-2017-18074?: CVE-2017-18074 primarily affects Qualcomm Mdm9607 Firmware. In total, 23 product configurations (CPEs) are listed as vulnerable; see the affected-products list for the exact versions.
How do I fix CVE-2017-18074?: Review the linked vendor and NVD advisories for patched versions and mitigations, then upgrade or apply the recommended workaround. Given its critical severity, prioritise patching exposed systems.
When was CVE-2017-18074 published?: CVE-2017-18074 was published on 2018-04-11 and last updated on 2026-06-17.

References

Affected products (23)

cpe:2.3:o:qualcomm:mdm9607_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:mdm9625_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:mdm9635m_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:mdm9640_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:mdm9645_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:mdm9650_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:mdm9655_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:msm8909w_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_210_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_212_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_205_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_400_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_410_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_412_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_425_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_430_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_615_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_616_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_415_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_808_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_810_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_820_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_835_firmware:-:*:*:*:*:*:*:*

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