How severe is CVE-2017-18170?

CVE-2017-18170 has a CVSS 3.x base score of 8.8, rated high severity. It is exploitable over an adjacent network with low attack complexity, requires no privileges and no user interaction. Impact on confidentiality is high, integrity high, and availability high.

Is CVE-2017-18170 being actively exploited?

It is not currently listed in CISA's KEV catalog. Its EPSS exploit-prediction score is 1% (41st percentile), an estimate of the probability of exploitation in the next 30 days.

What products are affected by CVE-2017-18170?

CVE-2017-18170 primarily affects Qualcomm Qca9379 Firmware. In total, 25 product configurations (CPEs) are listed as vulnerable; see the affected-products list for the exact versions.

How do I fix CVE-2017-18170?

Review the linked vendor and NVD advisories for patched versions and mitigations, then upgrade or apply the recommended workaround. Given its high severity, prioritise patching exposed systems.

When was CVE-2017-18170 published?

CVE-2017-18170 was published on 2018-10-23 and last updated on 2026-06-17.

CVE-2017-18170

CVE-2017-18170 is a high-severity vulnerability in Qualcomm Qca9379 Firmware with a CVSS 3.x base score of 8.8. It is not currently listed as actively exploited by CISA, and its EPSS exploit-prediction score is low. The underlying weakness is classified as CWE-191.

Key facts

Severity: High (CVSS 3.x base score 8.8)
CVSS v2: 8.3
EPSS exploit prediction: 1% (41st percentile)
Actively exploited: Not listed in CISA KEV
Weakness: CWE-191
Affected product: Qualcomm Qca9379 Firmware
Published: 2018-10-23
Last modified: 2026-06-17

Description

Improper input validation in Bluetooth Controller function can lead to possible memory corruption in Snapdragon Mobile in version QCA9379, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, SD 835, SD 845, SD 850, SDM630, SDM636, SDM660, SDM710, Snapdragon_High_Med_2016.

Frequently asked questions

What is CVE-2017-18170?: Improper input validation in Bluetooth Controller function can lead to possible memory corruption in Snapdragon Mobile in version QCA9379, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, SD 835, SD 845, SD 850, SDM630, SDM636, SDM660, SDM710, Snapdragon_High_Med_2016.
How severe is CVE-2017-18170?: CVE-2017-18170 has a CVSS 3.x base score of 8.8, rated high severity. It is exploitable over an adjacent network with low attack complexity, requires no privileges and no user interaction. Impact on confidentiality is high, integrity high, and availability high.
Is CVE-2017-18170 being actively exploited?: It is not currently listed in CISA's KEV catalog. Its EPSS exploit-prediction score is 1% (41st percentile), an estimate of the probability of exploitation in the next 30 days.
What products are affected by CVE-2017-18170?: CVE-2017-18170 primarily affects Qualcomm Qca9379 Firmware. In total, 25 product configurations (CPEs) are listed as vulnerable; see the affected-products list for the exact versions.
How do I fix CVE-2017-18170?: Review the linked vendor and NVD advisories for patched versions and mitigations, then upgrade or apply the recommended workaround. Given its high severity, prioritise patching exposed systems.
When was CVE-2017-18170 published?: CVE-2017-18170 was published on 2018-10-23 and last updated on 2026-06-17.

References

Affected products (25)

cpe:2.3:o:qualcomm:qca9379_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_210_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_212_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_205_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_410_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_412_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_425_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_427_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_430_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_435_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_450_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_615_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_616_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_415_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_625_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_650_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_652_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_820_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_835_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_845_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_850_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sdm630_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sdm636_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sdm660_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sdm710_firmware:-:*:*:*:*:*:*:*

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