How severe is CVE-2017-18173?

CVE-2017-18173 has a CVSS 3.x base score of 7.8, rated high severity. It is exploitable over local access with low attack complexity, requires low privileges and no user interaction. Impact on confidentiality is high, integrity high, and availability high.

Is CVE-2017-18173 being actively exploited?

It is not currently listed in CISA's KEV catalog. Its EPSS exploit-prediction score is 0% (13th percentile), an estimate of the probability of exploitation in the next 30 days.

What products are affected by CVE-2017-18173?

CVE-2017-18173 primarily affects Qualcomm Sd 425 Firmware. In total, 13 product configurations (CPEs) are listed as vulnerable; see the affected-products list for the exact versions.

How do I fix CVE-2017-18173?

Review the linked vendor and NVD advisories for patched versions and mitigations, then upgrade or apply the recommended workaround. Given its high severity, prioritise patching exposed systems.

When was CVE-2017-18173 published?

CVE-2017-18173 was published on 2019-05-06 and last updated on 2026-06-17.

CVE-2017-18173

CVE-2017-18173 is a high-severity vulnerability in Qualcomm Sd 425 Firmware with a CVSS 3.x base score of 7.8. It is not currently listed as actively exploited by CISA, and its EPSS exploit-prediction score is low. The underlying weakness is classified as CWE-190.

Key facts

Severity: High (CVSS 3.x base score 7.8)
CVSS v2: 7.2
EPSS exploit prediction: 0% (13th percentile)
Actively exploited: Not listed in CISA KEV
Weakness: CWE-190
Affected product: Qualcomm Sd 425 Firmware
Published: 2019-05-06
Last modified: 2026-06-17

Description

In case of using an invalid android verified boot signature with very large length, an integer underflow occurs in Snapdragon Mobile in SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 810, SD 820, SD 835, SDM630, SDM636, SDM660, Snapdragon_High_Med_2016.

Frequently asked questions

What is CVE-2017-18173?: In case of using an invalid android verified boot signature with very large length, an integer underflow occurs in Snapdragon Mobile in SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 810, SD 820, SD 835, SDM630, SDM636, SDM660, Snapdragon_High_Med_2016.
How severe is CVE-2017-18173?: CVE-2017-18173 has a CVSS 3.x base score of 7.8, rated high severity. It is exploitable over local access with low attack complexity, requires low privileges and no user interaction. Impact on confidentiality is high, integrity high, and availability high.
Is CVE-2017-18173 being actively exploited?: It is not currently listed in CISA's KEV catalog. Its EPSS exploit-prediction score is 0% (13th percentile), an estimate of the probability of exploitation in the next 30 days.
What products are affected by CVE-2017-18173?: CVE-2017-18173 primarily affects Qualcomm Sd 425 Firmware. In total, 13 product configurations (CPEs) are listed as vulnerable; see the affected-products list for the exact versions.
How do I fix CVE-2017-18173?: Review the linked vendor and NVD advisories for patched versions and mitigations, then upgrade or apply the recommended workaround. Given its high severity, prioritise patching exposed systems.
When was CVE-2017-18173 published?: CVE-2017-18173 was published on 2019-05-06 and last updated on 2026-06-17.

References

https://www.qualcomm.com/company/product-security/bulletins

Affected products (13)

cpe:2.3:o:qualcomm:sd_425_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_427_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_430_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_435_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_450_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_625_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_810_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_820_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_835_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sdm630_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sdm636_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sdm660_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:snapdragon_high_med_2016_firmware:-:*:*:*:*:*:*:*

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