How severe is CVE-2017-18280?

CVE-2017-18280 has a CVSS 3.x base score of 7.8, rated high severity. It is exploitable over local access with low attack complexity, requires low privileges and no user interaction. Impact on confidentiality is high, integrity high, and availability high.

Is CVE-2017-18280 being actively exploited?

It is not currently listed in CISA's KEV catalog. Its EPSS exploit-prediction score is 0% (16th percentile), an estimate of the probability of exploitation in the next 30 days.

What products are affected by CVE-2017-18280?

CVE-2017-18280 primarily affects Qualcomm Mdm9607 Firmware. In total, 21 product configurations (CPEs) are listed as vulnerable; see the affected-products list for the exact versions.

How do I fix CVE-2017-18280?

Review the linked vendor and NVD advisories for patched versions and mitigations, then upgrade or apply the recommended workaround. Given its high severity, prioritise patching exposed systems.

When was CVE-2017-18280 published?

CVE-2017-18280 was published on 2018-09-20 and last updated on 2026-06-17.

CVE-2017-18280

CVE-2017-18280 is a high-severity vulnerability in Qualcomm Mdm9607 Firmware with a CVSS 3.x base score of 7.8. It is not currently listed as actively exploited by CISA, and its EPSS exploit-prediction score is low.

Key facts

Severity: High (CVSS 3.x base score 7.8)
CVSS v2: 7.2
EPSS exploit prediction: 0% (16th percentile)
Actively exploited: Not listed in CISA KEV
Affected product: Qualcomm Mdm9607 Firmware
Published: 2018-09-20
Last modified: 2026-06-17

Description

In Snapdragon (Automobile, Mobile, Wear) in version MDM9607, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 617, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SDM429, SDM439, SDM632, Snapdragon_High_Med_2016, when a Trusted Application has opened the SPI/I2C interface to a particular device, it is possible for another Trusted Application to read the data on this open interface by calling the SPI/I2C read function.

Frequently asked questions

What is CVE-2017-18280?: In Snapdragon (Automobile, Mobile, Wear) in version MDM9607, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 617, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SDM429, SDM439, SDM632, Snapdragon_High_Med_2016, when a Trusted Application has opened the SPI/I2C interface to a particular device, it is possible for another Trusted Application to read the data on this open interface by calling the SPI/I2C read function.
How severe is CVE-2017-18280?: CVE-2017-18280 has a CVSS 3.x base score of 7.8, rated high severity. It is exploitable over local access with low attack complexity, requires low privileges and no user interaction. Impact on confidentiality is high, integrity high, and availability high.
Is CVE-2017-18280 being actively exploited?: It is not currently listed in CISA's KEV catalog. Its EPSS exploit-prediction score is 0% (16th percentile), an estimate of the probability of exploitation in the next 30 days.
What products are affected by CVE-2017-18280?: CVE-2017-18280 primarily affects Qualcomm Mdm9607 Firmware. In total, 21 product configurations (CPEs) are listed as vulnerable; see the affected-products list for the exact versions.
How do I fix CVE-2017-18280?: Review the linked vendor and NVD advisories for patched versions and mitigations, then upgrade or apply the recommended workaround. Given its high severity, prioritise patching exposed systems.
When was CVE-2017-18280 published?: CVE-2017-18280 was published on 2018-09-20 and last updated on 2026-06-17.

References

Affected products (21)

cpe:2.3:o:qualcomm:mdm9607_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:msm8909w_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:msm8996au_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd210_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd212_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd205_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd425_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd427_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd430_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd435_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd450_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd617_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd625_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd650_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd652_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd820_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd820a_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd835_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sdm429_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sdm439_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sdm632_firmware:-:*:*:*:*:*:*:*

More vulnerabilities in Qualcomm Mdm9607 Firmware

CVE-2018-11922 — Critical (CVSS 9.8): Wrong configuration in Touch Pal application can collect user behavior data without awareness by the user.
CVE-2022-40510 — Critical (CVSS 9.8): Memory corruption due to buffer copy without checking size of input in Audio while voice call with EVS vocoder.
CVE-2022-25727 — Critical (CVSS 9.8): Memory Corruption in modem due to improper length check while copying into memory in Snapdragon Consumer IOT,…
CVE-2022-25748 — Critical (CVSS 9.8): Memory corruption in WLAN due to integer overflow to buffer overflow while parsing GTK frames. in Snapdragon Auto,…
CVE-2022-25720 — Critical (CVSS 9.8): Memory corruption in WLAN due to out of bound array access during connect/roaming in Snapdragon Auto, Snapdragon…
CVE-2022-25651 — Critical (CVSS 9.8): Memory corruption in bluetooth host due to integer overflow while processing BT HFP-UNIT profile in Snapdragon Auto,…

All CVEs affecting Qualcomm Mdm9607 Firmware →