How severe is CVE-2017-18314?

CVE-2017-18314 has a CVSS 3.x base score of 9.8, rated critical severity. It is exploitable over network with low attack complexity, requires no privileges and no user interaction. Impact on confidentiality is high, integrity high, and availability high.

Is CVE-2017-18314 being actively exploited?

It is not currently listed in CISA's KEV catalog. Its EPSS exploit-prediction score is 1% (57th percentile), an estimate of the probability of exploitation in the next 30 days.

What products are affected by CVE-2017-18314?

CVE-2017-18314 primarily affects Qualcomm Mdm9206 Firmware. In total, 37 product configurations (CPEs) are listed as vulnerable; see the affected-products list for the exact versions.

How do I fix CVE-2017-18314?

Review the linked vendor and NVD advisories for patched versions and mitigations, then upgrade or apply the recommended workaround. Given its critical severity, prioritise patching exposed systems.

When was CVE-2017-18314 published?

CVE-2017-18314 was published on 2018-09-20 and last updated on 2026-06-17.

CVE-2017-18314

CVE-2017-18314 is a critical-severity vulnerability in Qualcomm Mdm9206 Firmware with a CVSS 3.x base score of 9.8. It is not currently listed as actively exploited by CISA, and its EPSS exploit-prediction score is low.

Key facts

Severity: Critical (CVSS 3.x base score 9.8)
CVSS v2: 10.0
EPSS exploit prediction: 1% (57th percentile)
Actively exploited: Not listed in CISA KEV
Affected product: Qualcomm Mdm9206 Firmware
Published: 2018-09-20
Last modified: 2026-06-17

Description

In Snapdragon (Automobile, Mobile, Wear) in version MDM9206, MDM9607, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, Snapdragon_High_Med_2016, on TZ cold boot the CNOC_QDSS RG0 locked by xBL_SEC is cleared by TZ.

Frequently asked questions

What is CVE-2017-18314?: In Snapdragon (Automobile, Mobile, Wear) in version MDM9206, MDM9607, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, Snapdragon_High_Med_2016, on TZ cold boot the CNOC_QDSS RG0 locked by xBL_SEC is cleared by TZ.
How severe is CVE-2017-18314?: CVE-2017-18314 has a CVSS 3.x base score of 9.8, rated critical severity. It is exploitable over network with low attack complexity, requires no privileges and no user interaction. Impact on confidentiality is high, integrity high, and availability high.
Is CVE-2017-18314 being actively exploited?: It is not currently listed in CISA's KEV catalog. Its EPSS exploit-prediction score is 1% (57th percentile), an estimate of the probability of exploitation in the next 30 days.
What products are affected by CVE-2017-18314?: CVE-2017-18314 primarily affects Qualcomm Mdm9206 Firmware. In total, 37 product configurations (CPEs) are listed as vulnerable; see the affected-products list for the exact versions.
How do I fix CVE-2017-18314?: Review the linked vendor and NVD advisories for patched versions and mitigations, then upgrade or apply the recommended workaround. Given its critical severity, prioritise patching exposed systems.
When was CVE-2017-18314 published?: CVE-2017-18314 was published on 2018-09-20 and last updated on 2026-06-17.

References

Affected products (37)

cpe:2.3:o:qualcomm:mdm9206_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:mdm9607_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:mdm9635m_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:mdm9640_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:mdm9645_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:mdm9650_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:mdm9655_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:msm8909w_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:msm8996au_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd210_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd212_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd205_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd410_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd412_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd425_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd427_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd430_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd435_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd450_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd615_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd616_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd415_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd617_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd625_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd650_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd652_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd810_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd820_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd820a_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd835_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sda660_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sdm429_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sdm439_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sdm630_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sdm632_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sdm636_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sdm660_firmware:-:*:*:*:*:*:*:*

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