How severe is CVE-2017-18324?

CVE-2017-18324 has a CVSS 3.x base score of 5.5, rated medium severity. It is exploitable over local access with low attack complexity, requires low privileges and no user interaction. Impact on confidentiality is high, integrity none, and availability none.

Is CVE-2017-18324 being actively exploited?

It is not currently listed in CISA's KEV catalog. Its EPSS exploit-prediction score is 0% (11th percentile), an estimate of the probability of exploitation in the next 30 days.

What products are affected by CVE-2017-18324?

CVE-2017-18324 primarily affects Qualcomm Mdm9206 Firmware. In total, 32 product configurations (CPEs) are listed as vulnerable; see the affected-products list for the exact versions.

How do I fix CVE-2017-18324?

Review the linked vendor and NVD advisories for patched versions and mitigations, then upgrade or apply the recommended workaround.

When was CVE-2017-18324 published?

CVE-2017-18324 was published on 2019-01-03 and last updated on 2026-06-17.

CVE-2017-18324

CVE-2017-18324 is a medium-severity vulnerability in Qualcomm Mdm9206 Firmware with a CVSS 3.x base score of 5.5. It is not currently listed as actively exploited by CISA, and its EPSS exploit-prediction score is low. The underlying weakness is classified as CWE-200.

Key facts

Severity: Medium (CVSS 3.x base score 5.5)
CVSS v2: 2.1
EPSS exploit prediction: 0% (11th percentile)
Actively exploited: Not listed in CISA KEV
Weakness: CWE-200
Affected product: Qualcomm Mdm9206 Firmware
Published: 2019-01-03
Last modified: 2026-06-17

Description

Cryptographic key material leaked in debug messages - GERAN in snapdragon mobile and snapdragon wear in versions MDM9206, MDM9607, MDM9615, MDM9625, MDM9635M, MDM9645, MDM9650, MDM9655, MSM8909W, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 800, SD 810, SD 820, SD 835, SD 855, SDX24, Snapdragon_High_Med_2016.

Frequently asked questions

What is CVE-2017-18324?: Cryptographic key material leaked in debug messages - GERAN in snapdragon mobile and snapdragon wear in versions MDM9206, MDM9607, MDM9615, MDM9625, MDM9635M, MDM9645, MDM9650, MDM9655, MSM8909W, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 800, SD 810, SD 820, SD 835, SD 855, SDX24, Snapdragon_High_Med_2016.
How severe is CVE-2017-18324?: CVE-2017-18324 has a CVSS 3.x base score of 5.5, rated medium severity. It is exploitable over local access with low attack complexity, requires low privileges and no user interaction. Impact on confidentiality is high, integrity none, and availability none.
Is CVE-2017-18324 being actively exploited?: It is not currently listed in CISA's KEV catalog. Its EPSS exploit-prediction score is 0% (11th percentile), an estimate of the probability of exploitation in the next 30 days.
What products are affected by CVE-2017-18324?: CVE-2017-18324 primarily affects Qualcomm Mdm9206 Firmware. In total, 32 product configurations (CPEs) are listed as vulnerable; see the affected-products list for the exact versions.
How do I fix CVE-2017-18324?: Review the linked vendor and NVD advisories for patched versions and mitigations, then upgrade or apply the recommended workaround.
When was CVE-2017-18324 published?: CVE-2017-18324 was published on 2019-01-03 and last updated on 2026-06-17.

References

Affected products (32)

cpe:2.3:o:qualcomm:mdm9206_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:mdm9607_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:mdm9615_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:mdm9625_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:mdm9635m_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:mdm9645_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:mdm9650_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:mdm9655_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:msm8909w_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_210_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_212_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_205_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_410_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_412_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_425_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_427_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_430_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_435_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_450_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_615_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_616_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_415_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_625_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_650_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_652_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_800_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_810_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_820_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_835_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_855_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sdx24_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:snapdragon_high_med_2016_firmware:-:*:*:*:*:*:*:*

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