How severe is CVE-2017-18326?

CVE-2017-18326 has a CVSS 3.x base score of 5.5, rated medium severity. It is exploitable over local access with low attack complexity, requires low privileges and no user interaction. Impact on confidentiality is high, integrity none, and availability none.

Is CVE-2017-18326 being actively exploited?

It is not currently listed in CISA's KEV catalog. Its EPSS exploit-prediction score is 0% (11th percentile), an estimate of the probability of exploitation in the next 30 days.

What products are affected by CVE-2017-18326?

CVE-2017-18326 primarily affects Qualcomm Mdm9607 Firmware. In total, 34 product configurations (CPEs) are listed as vulnerable; see the affected-products list for the exact versions.

How do I fix CVE-2017-18326?

Review the linked vendor and NVD advisories for patched versions and mitigations, then upgrade or apply the recommended workaround.

When was CVE-2017-18326 published?

CVE-2017-18326 was published on 2019-01-03 and last updated on 2026-06-17.

CVE-2017-18326

CVE-2017-18326 is a medium-severity vulnerability in Qualcomm Mdm9607 Firmware with a CVSS 3.x base score of 5.5. It is not currently listed as actively exploited by CISA, and its EPSS exploit-prediction score is low. The underlying weakness is classified as CWE-200.

Key facts

Severity: Medium (CVSS 3.x base score 5.5)
CVSS v2: 2.1
EPSS exploit prediction: 0% (11th percentile)
Actively exploited: Not listed in CISA KEV
Weakness: CWE-200
Affected product: Qualcomm Mdm9607 Firmware
Published: 2019-01-03
Last modified: 2026-06-17

Description

Cryptographic keys are printed in modem debug messages in snapdragon mobile and snapdragon wear in versions MDM9607, MDM9615, MDM9625, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 636, SD 650/52, SD 800, SD 810, SD 820, SD 835, SDA660, SDM630, SDM660, Snapdragon_High_Med_2016.

Frequently asked questions

What is CVE-2017-18326?: Cryptographic keys are printed in modem debug messages in snapdragon mobile and snapdragon wear in versions MDM9607, MDM9615, MDM9625, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 636, SD 650/52, SD 800, SD 810, SD 820, SD 835, SDA660, SDM630, SDM660, Snapdragon_High_Med_2016.
How severe is CVE-2017-18326?: CVE-2017-18326 has a CVSS 3.x base score of 5.5, rated medium severity. It is exploitable over local access with low attack complexity, requires low privileges and no user interaction. Impact on confidentiality is high, integrity none, and availability none.
Is CVE-2017-18326 being actively exploited?: It is not currently listed in CISA's KEV catalog. Its EPSS exploit-prediction score is 0% (11th percentile), an estimate of the probability of exploitation in the next 30 days.
What products are affected by CVE-2017-18326?: CVE-2017-18326 primarily affects Qualcomm Mdm9607 Firmware. In total, 34 product configurations (CPEs) are listed as vulnerable; see the affected-products list for the exact versions.
How do I fix CVE-2017-18326?: Review the linked vendor and NVD advisories for patched versions and mitigations, then upgrade or apply the recommended workaround.
When was CVE-2017-18326 published?: CVE-2017-18326 was published on 2019-01-03 and last updated on 2026-06-17.

References

Affected products (34)

cpe:2.3:o:qualcomm:mdm9607_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:mdm9615_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:mdm9625_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:mdm9635m_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:mdm9640_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:mdm9645_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:mdm9650_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:mdm9655_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:msm8909w_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_210_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_212_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_205_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_410_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_412_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_425_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_427_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_430_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_435_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_450_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_615_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_616_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_415_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_625_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_636_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_650_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_652_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_800_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_810_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_820_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_835_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sda660_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sdm630_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sdm660_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:snapdragon_high_med_2016_firmware:-:*:*:*:*:*:*:*

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