How severe is CVE-2018-11855?

CVE-2018-11855 has a CVSS 3.x base score of 7.8, rated high severity. It is exploitable over local access with low attack complexity, requires low privileges and no user interaction. Impact on confidentiality is high, integrity high, and availability high.

Is CVE-2018-11855 being actively exploited?

It is not currently listed in CISA's KEV catalog. Its EPSS exploit-prediction score is 0% (11th percentile), an estimate of the probability of exploitation in the next 30 days.

What products are affected by CVE-2018-11855?

CVE-2018-11855 primarily affects Qualcomm Mdm9607 Firmware. In total, 17 product configurations (CPEs) are listed as vulnerable; see the affected-products list for the exact versions.

How do I fix CVE-2018-11855?

Review the linked vendor and NVD advisories for patched versions and mitigations, then upgrade or apply the recommended workaround. Given its high severity, prioritise patching exposed systems.

When was CVE-2018-11855 published?

CVE-2018-11855 was published on 2019-02-11 and last updated on 2026-06-17.

CVE-2018-11855

CVE-2018-11855 is a high-severity vulnerability in Qualcomm Mdm9607 Firmware with a CVSS 3.x base score of 7.8. It is not currently listed as actively exploited by CISA, and its EPSS exploit-prediction score is low. The underlying weakness is classified as CWE-190.

Key facts

Severity: High (CVSS 3.x base score 7.8)
CVSS v2: 7.2
EPSS exploit prediction: 0% (11th percentile)
Actively exploited: Not listed in CISA KEV
Weakness: CWE-190
Affected product: Qualcomm Mdm9607 Firmware
Published: 2019-02-11
Last modified: 2026-06-17

Description

If an end user makes use of SCP11 sample OCE code without modification it could lead to a buffer overflow when transmitting a CAPDU in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT and Snapdragon Mobile in versions MDM9607, MDM9650, MDM9655, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 636, SD 820, SD 820A, SD 835, SD 8CX, SDA660, SDM630, SDM660.

Frequently asked questions

What is CVE-2018-11855?: If an end user makes use of SCP11 sample OCE code without modification it could lead to a buffer overflow when transmitting a CAPDU in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT and Snapdragon Mobile in versions MDM9607, MDM9650, MDM9655, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 636, SD 820, SD 820A, SD 835, SD 8CX, SDA660, SDM630, SDM660.
How severe is CVE-2018-11855?: CVE-2018-11855 has a CVSS 3.x base score of 7.8, rated high severity. It is exploitable over local access with low attack complexity, requires low privileges and no user interaction. Impact on confidentiality is high, integrity high, and availability high.
Is CVE-2018-11855 being actively exploited?: It is not currently listed in CISA's KEV catalog. Its EPSS exploit-prediction score is 0% (11th percentile), an estimate of the probability of exploitation in the next 30 days.
What products are affected by CVE-2018-11855?: CVE-2018-11855 primarily affects Qualcomm Mdm9607 Firmware. In total, 17 product configurations (CPEs) are listed as vulnerable; see the affected-products list for the exact versions.
How do I fix CVE-2018-11855?: Review the linked vendor and NVD advisories for patched versions and mitigations, then upgrade or apply the recommended workaround. Given its high severity, prioritise patching exposed systems.
When was CVE-2018-11855 published?: CVE-2018-11855 was published on 2019-02-11 and last updated on 2026-06-17.

References

https://www.qualcomm.com/company/product-security/bulletins

Affected products (17)

cpe:2.3:o:qualcomm:mdm9607_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:mdm9650_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:mdm9655_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:msm8996au_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_210_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_212_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_205_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_410_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_412_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_636_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_820_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_820a_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_835_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_8cx_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sda660_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sdm630_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sdm660_firmware:-:*:*:*:*:*:*:*

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