CVE-2018-11967

CVE-2018-11967 is a high-severity vulnerability in Qualcomm Mdm9150 Firmware with a CVSS 3.x base score of 7.8. It is not currently listed as actively exploited by CISA, and its EPSS exploit-prediction score is low.

Key facts

• Severity: High (CVSS 3.x base score 7.8)
• CVSS v2: 7.2
• EPSS exploit prediction: 0% (11th percentile)
• Actively exploited: Not listed in CISA KEV
• Affected product: Qualcomm Mdm9150 Firmware
• Published: 2019-05-24
• Last modified: 2026-06-17

Description

Signature verification of the skel library could potentially be disabled as the memory region on the remote subsystem in which the library is loaded is allocated from userspace currently in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables in MDM9150, MDM9206, MDM9607, MDM9640, MDM9650, MSM8909W, MSM8996AU, QCS605, Qualcomm 215, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 625, SD 632, SD 636, SD 650/52, SD 712 / SD 710 / SD 670, SD 820, SD 820A, SD 835, SD 845 / SD 850, SD 855, SDA660, SDM439, SDM630, SDM660, SDX20, SDX24

Frequently asked questions

What is CVE-2018-11967?

Signature verification of the skel library could potentially be disabled as the memory region on the remote subsystem in which the library is loaded is allocated from userspace currently in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables in MDM9150, MDM9206, MDM9607, MDM9640, MDM9650, MSM8909W, MSM8996AU, QCS605, Qualcomm 215, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 625, SD 632, SD 636, SD 650/52, SD 712 / SD 710 / SD 670, SD 820, SD 820A, SD 835, SD 845 / SD 850, SD 855, SDA660, SDM439, SDM630, SDM660, SDX20, SDX24

How severe is CVE-2018-11967?

CVE-2018-11967 has a CVSS 3.x base score of 7.8, rated high severity. It is exploitable over local access with low attack complexity, requires low privileges and no user interaction. Impact on confidentiality is high, integrity high, and availability high.

Is CVE-2018-11967 being actively exploited?

It is not currently listed in CISA's KEV catalog. Its EPSS exploit-prediction score is 0% (11th percentile), an estimate of the probability of exploitation in the next 30 days.

What products are affected by CVE-2018-11967?

CVE-2018-11967 primarily affects Qualcomm Mdm9150 Firmware. In total, 36 product configurations (CPEs) are listed as vulnerable; see the affected-products list for the exact versions.

How do I fix CVE-2018-11967?

Review the linked vendor and NVD advisories for patched versions and mitigations, then upgrade or apply the recommended workaround. Given its high severity, prioritise patching exposed systems.

When was CVE-2018-11967 published?

CVE-2018-11967 was published on 2019-05-24 and last updated on 2026-06-17.

References

• https://www.codeaurora.org/security-bulletin/2019/04/01/april-2019-code-aurora-security-bulletin

Affected products (36)

• cpe:2.3:o:qualcomm:mdm9150_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:mdm9206_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:mdm9607_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:mdm9640_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:mdm9650_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:msm8909w_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:msm8996au_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:qcs605_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:qm215_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:sd_425_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:sd_427_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:sd_430_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:sd_435_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:sd_439_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:sd_429_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:sd_450_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:sd_625_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:sd_632_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:sd_636_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:sd_650_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:sd_652_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:sd_712_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:sd_710_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:sd_670_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:sd_820_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:sd_820a_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:sd_835_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:sd_845_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:sd_850_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:sd_855_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:sda660_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:sdm439_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:sdm630_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:sdm660_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:sdx20_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:sdx24_firmware:-:*:*:*:*:*:*:*

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