How severe is CVE-2018-12005?

CVE-2018-12005 has a CVSS 3.x base score of 5.5, rated medium severity. It is exploitable over local access with low attack complexity, requires low privileges and no user interaction. Impact on confidentiality is none, integrity none, and availability high.

Is CVE-2018-12005 being actively exploited?

It is not currently listed in CISA's KEV catalog. Its EPSS exploit-prediction score is 0% (7th percentile), an estimate of the probability of exploitation in the next 30 days.

What products are affected by CVE-2018-12005?

CVE-2018-12005 primarily affects Qualcomm Mdm9150 Firmware. In total, 35 product configurations (CPEs) are listed as vulnerable; see the affected-products list for the exact versions.

How do I fix CVE-2018-12005?

Review the linked vendor and NVD advisories for patched versions and mitigations, then upgrade or apply the recommended workaround.

When was CVE-2018-12005 published?

CVE-2018-12005 was published on 2019-05-24 and last updated on 2026-06-17.

CVE-2018-12005

CVE-2018-12005 is a medium-severity vulnerability in Qualcomm Mdm9150 Firmware with a CVSS 3.x base score of 5.5. It is not currently listed as actively exploited by CISA, and its EPSS exploit-prediction score is low. The underlying weakness is classified as CWE-416.

Key facts

Severity: Medium (CVSS 3.x base score 5.5)
CVSS v2: 4.9
EPSS exploit prediction: 0% (7th percentile)
Actively exploited: Not listed in CISA KEV
Weakness: CWE-416
Affected product: Qualcomm Mdm9150 Firmware
Published: 2019-05-24
Last modified: 2026-06-17

Description

An unprivileged user can issue a binder call and cause a system halt in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables in MDM9150, MDM9206, MDM9607, MDM9640, MDM9650, MSM8909W, MSM8996AU, QCS605, Qualcomm 215, SD 210/SD 212/SD 205, SD 425, SD 439 / SD 429, SD 450, SD 625, SD 632, SD 636, SD 675, SD 712 / SD 710 / SD 670, SD 820A, SD 835, SD 845 / SD 850, SD 855, SDA660, SDM439, SDM630, SDM660, SDX20, SDX24, SM7150

Frequently asked questions

What is CVE-2018-12005?: An unprivileged user can issue a binder call and cause a system halt in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables in MDM9150, MDM9206, MDM9607, MDM9640, MDM9650, MSM8909W, MSM8996AU, QCS605, Qualcomm 215, SD 210/SD 212/SD 205, SD 425, SD 439 / SD 429, SD 450, SD 625, SD 632, SD 636, SD 675, SD 712 / SD 710 / SD 670, SD 820A, SD 835, SD 845 / SD 850, SD 855, SDA660, SDM439, SDM630, SDM660, SDX20, SDX24, SM7150
How severe is CVE-2018-12005?: CVE-2018-12005 has a CVSS 3.x base score of 5.5, rated medium severity. It is exploitable over local access with low attack complexity, requires low privileges and no user interaction. Impact on confidentiality is none, integrity none, and availability high.
Is CVE-2018-12005 being actively exploited?: It is not currently listed in CISA's KEV catalog. Its EPSS exploit-prediction score is 0% (7th percentile), an estimate of the probability of exploitation in the next 30 days.
What products are affected by CVE-2018-12005?: CVE-2018-12005 primarily affects Qualcomm Mdm9150 Firmware. In total, 35 product configurations (CPEs) are listed as vulnerable; see the affected-products list for the exact versions.
How do I fix CVE-2018-12005?: Review the linked vendor and NVD advisories for patched versions and mitigations, then upgrade or apply the recommended workaround.
When was CVE-2018-12005 published?: CVE-2018-12005 was published on 2019-05-24 and last updated on 2026-06-17.

References

https://www.qualcomm.com/company/product-security/bulletins#_CVE-2018-12005

Affected products (35)

cpe:2.3:o:qualcomm:mdm9150_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:mdm9206_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:mdm9607_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:mdm9640_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:mdm9650_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:msm8909w_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:msm8996au_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qcs605_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qm215_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_210_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_212_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_205_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_425_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_439_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_429_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_450_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_625_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_632_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_636_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_675_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_712_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_710_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_670_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_820a_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_835_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_845_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_850_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_855_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sda660_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sdm439_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sdm630_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sdm660_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sdx20_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sdx24_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sm7150_firmware:-:*:*:*:*:*:*:*

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