How severe is CVE-2018-12013?

CVE-2018-12013 has a CVSS 3.x base score of 7.8, rated high severity. It is exploitable over local access with low attack complexity, requires low privileges and no user interaction. Impact on confidentiality is high, integrity high, and availability high.

Is CVE-2018-12013 being actively exploited?

It is not currently listed in CISA's KEV catalog. Its EPSS exploit-prediction score is 0% (10th percentile), an estimate of the probability of exploitation in the next 30 days.

What products are affected by CVE-2018-12013?

CVE-2018-12013 primarily affects Qualcomm Mdm9206 Firmware. In total, 25 product configurations (CPEs) are listed as vulnerable; see the affected-products list for the exact versions.

How do I fix CVE-2018-12013?

Review the linked vendor and NVD advisories for patched versions and mitigations, then upgrade or apply the recommended workaround. Given its high severity, prioritise patching exposed systems.

When was CVE-2018-12013 published?

CVE-2018-12013 was published on 2019-05-24 and last updated on 2026-06-17.

CVE-2018-12013

CVE-2018-12013 is a high-severity vulnerability in Qualcomm Mdm9206 Firmware with a CVSS 3.x base score of 7.8. It is not currently listed as actively exploited by CISA, and its EPSS exploit-prediction score is low. The underlying weakness is classified as CWE-287.

Key facts

Severity: High (CVSS 3.x base score 7.8)
CVSS v2: 7.2
EPSS exploit prediction: 0% (10th percentile)
Actively exploited: Not listed in CISA KEV
Weakness: CWE-287
Affected product: Qualcomm Mdm9206 Firmware
Published: 2019-05-24
Last modified: 2026-06-17

Description

Improper authentication in locked memory region can lead to unprivilged access to the memory in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables in MDM9206, MDM9607, MDM9650, MDM9655, QCS605, SD 210/SD 212/SD 205, SD 410/12, SD 615/16/SD 415, SD 636, SD 712 / SD 710 / SD 670, SD 835, SD 845 / SD 850, SD 8CX, SDA660, SDM630, SDM660, SXR1130

Frequently asked questions

What is CVE-2018-12013?: Improper authentication in locked memory region can lead to unprivilged access to the memory in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables in MDM9206, MDM9607, MDM9650, MDM9655, QCS605, SD 210/SD 212/SD 205, SD 410/12, SD 615/16/SD 415, SD 636, SD 712 / SD 710 / SD 670, SD 835, SD 845 / SD 850, SD 8CX, SDA660, SDM630, SDM660, SXR1130
How severe is CVE-2018-12013?: CVE-2018-12013 has a CVSS 3.x base score of 7.8, rated high severity. It is exploitable over local access with low attack complexity, requires low privileges and no user interaction. Impact on confidentiality is high, integrity high, and availability high.
Is CVE-2018-12013 being actively exploited?: It is not currently listed in CISA's KEV catalog. Its EPSS exploit-prediction score is 0% (10th percentile), an estimate of the probability of exploitation in the next 30 days.
What products are affected by CVE-2018-12013?: CVE-2018-12013 primarily affects Qualcomm Mdm9206 Firmware. In total, 25 product configurations (CPEs) are listed as vulnerable; see the affected-products list for the exact versions.
How do I fix CVE-2018-12013?: Review the linked vendor and NVD advisories for patched versions and mitigations, then upgrade or apply the recommended workaround. Given its high severity, prioritise patching exposed systems.
When was CVE-2018-12013 published?: CVE-2018-12013 was published on 2019-05-24 and last updated on 2026-06-17.

References

https://www.qualcomm.com/company/product-security/bulletins#_CVE-2018-12013

Affected products (25)

cpe:2.3:o:qualcomm:mdm9206_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:mdm9607_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:mdm9650_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:mdm9655_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qcs605_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_210_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_212_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_205_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_410_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_412_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_615_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_616_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_415_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_636_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_712_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_710_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_670_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_835_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_845_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_850_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_8cx_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sda660_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sdm630_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sdm660_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sxr1130_firmware:-:*:*:*:*:*:*:*

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