How severe is CVE-2018-13887?

CVE-2018-13887 has a CVSS 3.x base score of 9.8, rated critical severity. It is exploitable over network with low attack complexity, requires no privileges and no user interaction. Impact on confidentiality is high, integrity high, and availability high.

Is CVE-2018-13887 being actively exploited?

It is not currently listed in CISA's KEV catalog. Its EPSS exploit-prediction score is 1% (62nd percentile), an estimate of the probability of exploitation in the next 30 days.

What products are affected by CVE-2018-13887?

CVE-2018-13887 primarily affects Qualcomm Mdm9150 Firmware. In total, 37 product configurations (CPEs) are listed as vulnerable; see the affected-products list for the exact versions.

How do I fix CVE-2018-13887?

Review the linked vendor and NVD advisories for patched versions and mitigations, then upgrade or apply the recommended workaround. Given its critical severity, prioritise patching exposed systems.

When was CVE-2018-13887 published?

CVE-2018-13887 was published on 2019-05-24 and last updated on 2026-06-17.

CVE-2018-13887

CVE-2018-13887 is a critical-severity vulnerability in Qualcomm Mdm9150 Firmware with a CVSS 3.x base score of 9.8. It is not currently listed as actively exploited by CISA, and its EPSS exploit-prediction score is low. The underlying weakness is classified as CWE-190.

Key facts

Severity: Critical (CVSS 3.x base score 9.8)
CVSS v2: 10.0
EPSS exploit prediction: 1% (62nd percentile)
Actively exploited: Not listed in CISA KEV
Weakness: CWE-190
Affected product: Qualcomm Mdm9150 Firmware
Published: 2019-05-24
Last modified: 2026-06-17

Description

Untrusted header fields in GNSS XTRA3 function can lead to integer overflow in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables in MDM9150, MDM9206, MDM9607, MDM9635M, MDM9650, MDM9655, MSM8909W, QCS605, Qualcomm 215, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 600, SD 625, SD 632, SD 636, SD 675, SD 712 / SD 710 / SD 670, SD 835, SD 845 / SD 850, SDA660, SDM439, SDM630, SDM660, SDX20, SM7150, SXR1130

Frequently asked questions

What is CVE-2018-13887?: Untrusted header fields in GNSS XTRA3 function can lead to integer overflow in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables in MDM9150, MDM9206, MDM9607, MDM9635M, MDM9650, MDM9655, MSM8909W, QCS605, Qualcomm 215, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 600, SD 625, SD 632, SD 636, SD 675, SD 712 / SD 710 / SD 670, SD 835, SD 845 / SD 850, SDA660, SDM439, SDM630, SDM660, SDX20, SM7150, SXR1130
How severe is CVE-2018-13887?: CVE-2018-13887 has a CVSS 3.x base score of 9.8, rated critical severity. It is exploitable over network with low attack complexity, requires no privileges and no user interaction. Impact on confidentiality is high, integrity high, and availability high.
Is CVE-2018-13887 being actively exploited?: It is not currently listed in CISA's KEV catalog. Its EPSS exploit-prediction score is 1% (62nd percentile), an estimate of the probability of exploitation in the next 30 days.
What products are affected by CVE-2018-13887?: CVE-2018-13887 primarily affects Qualcomm Mdm9150 Firmware. In total, 37 product configurations (CPEs) are listed as vulnerable; see the affected-products list for the exact versions.
How do I fix CVE-2018-13887?: Review the linked vendor and NVD advisories for patched versions and mitigations, then upgrade or apply the recommended workaround. Given its critical severity, prioritise patching exposed systems.
When was CVE-2018-13887 published?: CVE-2018-13887 was published on 2019-05-24 and last updated on 2026-06-17.

References

https://www.qualcomm.com/company/product-security/bulletins#_CVE-2018-13887

Affected products (37)

cpe:2.3:o:qualcomm:mdm9150_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:mdm9206_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:mdm9607_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:mdm9635m_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:mdm9650_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:mdm9655_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:msm8909w_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qcs605_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qm215_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_210_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_212_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_205_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_425_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_427_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_430_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_435_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_439_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_429_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_450_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_600_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_625_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_632_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_636_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_675_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_712_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_710_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_670_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_835_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_845_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_850_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sda660_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sdm439_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sdm630_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sdm660_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sdx20_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sm7150_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sxr1130_firmware:-:*:*:*:*:*:*:*

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