How severe is CVE-2018-13901?

CVE-2018-13901 has a CVSS 3.x base score of 5.5, rated medium severity. It is exploitable over local access with low attack complexity, requires low privileges and no user interaction. Impact on confidentiality is high, integrity none, and availability none.

Is CVE-2018-13901 being actively exploited?

It is not currently listed in CISA's KEV catalog. Its EPSS exploit-prediction score is 0% (9th percentile), an estimate of the probability of exploitation in the next 30 days.

What products are affected by CVE-2018-13901?

CVE-2018-13901 primarily affects Qualcomm Mdm9206 Firmware. In total, 30 product configurations (CPEs) are listed as vulnerable; see the affected-products list for the exact versions.

How do I fix CVE-2018-13901?

Review the linked vendor and NVD advisories for patched versions and mitigations, then upgrade or apply the recommended workaround.

When was CVE-2018-13901 published?

CVE-2018-13901 was published on 2019-06-14 and last updated on 2026-06-17.

CVE-2018-13901

CVE-2018-13901 is a medium-severity vulnerability in Qualcomm Mdm9206 Firmware with a CVSS 3.x base score of 5.5. It is not currently listed as actively exploited by CISA, and its EPSS exploit-prediction score is low.

Key facts

Severity: Medium (CVSS 3.x base score 5.5)
CVSS v2: 2.1
EPSS exploit prediction: 0% (9th percentile)
Actively exploited: Not listed in CISA KEV
Affected product: Qualcomm Mdm9206 Firmware
Published: 2019-06-14
Last modified: 2026-06-17

Description

Due to missing permissions in Android Manifest file, Sensitive information disclosure issue can happen in PCI RCS app in Snapdragon Auto, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables in MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, QCA6574AU, QCS605, SD 210/SD 212/SD 205, SD 615/16/SD 415, SD 636, SD 650/52, SD 675, SD 712 / SD 710 / SD 670, SD 730, SD 820, SD 820A, SD 835, SD 845 / SD 850, SD 855, SDA660, SDM630, SDM660

Frequently asked questions

What is CVE-2018-13901?: Due to missing permissions in Android Manifest file, Sensitive information disclosure issue can happen in PCI RCS app in Snapdragon Auto, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables in MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, QCA6574AU, QCS605, SD 210/SD 212/SD 205, SD 615/16/SD 415, SD 636, SD 650/52, SD 675, SD 712 / SD 710 / SD 670, SD 730, SD 820, SD 820A, SD 835, SD 845 / SD 850, SD 855, SDA660, SDM630, SDM660
How severe is CVE-2018-13901?: CVE-2018-13901 has a CVSS 3.x base score of 5.5, rated medium severity. It is exploitable over local access with low attack complexity, requires low privileges and no user interaction. Impact on confidentiality is high, integrity none, and availability none.
Is CVE-2018-13901 being actively exploited?: It is not currently listed in CISA's KEV catalog. Its EPSS exploit-prediction score is 0% (9th percentile), an estimate of the probability of exploitation in the next 30 days.
What products are affected by CVE-2018-13901?: CVE-2018-13901 primarily affects Qualcomm Mdm9206 Firmware. In total, 30 product configurations (CPEs) are listed as vulnerable; see the affected-products list for the exact versions.
How do I fix CVE-2018-13901?: Review the linked vendor and NVD advisories for patched versions and mitigations, then upgrade or apply the recommended workaround.
When was CVE-2018-13901 published?: CVE-2018-13901 was published on 2019-06-14 and last updated on 2026-06-17.

References

https://www.qualcomm.com/company/product-security/bulletins

Affected products (30)

cpe:2.3:o:qualcomm:mdm9206_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:mdm9607_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:mdm9650_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:msm8909w_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:msm8996au_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qca6574au_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qcs605_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_210_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_212_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_205_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_615_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_616_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_415_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_636_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_650_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_652_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_675_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_712_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_710_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_670_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_730_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_820_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_820a_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_835_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_845_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_850_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_855_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sda660_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sdm630_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sdm660_firmware:-:*:*:*:*:*:*:*

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