CVE-2018-13906
CVE-2018-13906 is a critical-severity vulnerability in Qualcomm Ipq4019 Firmware with a CVSS 3.x base score of 9.1. It is not currently listed as actively exploited by CISA, and its EPSS exploit-prediction score is low. The underlying weakness is classified as CWE-20.
Key facts
- Severity: Critical (CVSS 3.x base score 9.1)
- CVSS v2: 6.4
- EPSS exploit prediction: 1% (47th percentile)
- Actively exploited: Not listed in CISA KEV
- Weakness: CWE-20
- Affected product: Qualcomm Ipq4019 Firmware
- Published:
- Last modified:
Description
The HMAC authenticating the message from QSEE is vulnerable to timing side channel analysis leading to potentially forged application message in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking in IPQ4019, IPQ8074, MDM9150, MDM9206, MDM9607, MDM9635M, MDM9640, MDM9650, MDM9655, MSM8909W, MSM8996AU, QCA8081, QCS405, QCS605, Qualcomm 215, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 615/16/SD 415, SD 625, SD 632, SD 636, SD 650/52, SD 712 / SD 710 / SD 670, SD 820, SD 820A, SD 835, SD 845 / SD 850, SD 855, SD 8CX, SDA660, SDM439, SDM630, SDM660, SDX20, Snapdragon_High_Med_2016, SXR1130
Frequently asked questions
- What is CVE-2018-13906?
- The HMAC authenticating the message from QSEE is vulnerable to timing side channel analysis leading to potentially forged application message in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking in IPQ4019, IPQ8074, MDM9150, MDM9206, MDM9607, MDM9635M, MDM9640, MDM9650, MDM9655, MSM8909W, MSM8996AU, QCA8081, QCS405, QCS605, Qualcomm 215, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 615/16/SD 415, SD 625, SD 632, SD 636, SD 650/52, SD 712 / SD 710 / SD 670, SD 820, SD 820A, SD 835, SD 845 / SD 850, SD 855, SD 8CX, SDA660, SDM439, SDM630, SDM660, SDX20, Snapdragon_High_Med_2016, SXR1130
- How severe is CVE-2018-13906?
- CVE-2018-13906 has a CVSS 3.x base score of 9.1, rated critical severity. It is exploitable over network with low attack complexity, requires no privileges and no user interaction. Impact on confidentiality is high, integrity high, and availability none.
- Is CVE-2018-13906 being actively exploited?
- It is not currently listed in CISA's KEV catalog. Its EPSS exploit-prediction score is 1% (47th percentile), an estimate of the probability of exploitation in the next 30 days.
- What products are affected by CVE-2018-13906?
- CVE-2018-13906 primarily affects Qualcomm Ipq4019 Firmware. In total, 52 product configurations (CPEs) are listed as vulnerable; see the affected-products list for the exact versions.
- How do I fix CVE-2018-13906?
- Review the linked vendor and NVD advisories for patched versions and mitigations, then upgrade or apply the recommended workaround. Given its critical severity, prioritise patching exposed systems.
- When was CVE-2018-13906 published?
- CVE-2018-13906 was published on 2019-06-14 and last updated on 2026-06-17.
References
Affected products (52)
- cpe:2.3:o:qualcomm:ipq4019_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:ipq8074_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:mdm9150_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:mdm9206_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:mdm9607_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:mdm9635m_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:mdm9640_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:mdm9650_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:mdm9655_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:msm8909w_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:msm8996au_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca8081_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qcs405_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qcs605_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qualcomm_215_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd_210_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd_212_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd_205_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd_410_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd_412_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd_425_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd_427_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd_430_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd_435_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd_439_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd_429_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd_450_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd_615_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd_616_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd_415_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd_625_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd_632_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd_636_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd_650_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd_652_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd_712_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd_710_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd_670_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd_820_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd_820a_firmware:-:*:*:*:*:*:*:*
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