How severe is CVE-2018-5871?

CVE-2018-5871 has a CVSS 3.x base score of 6.5, rated medium severity. It is exploitable over an adjacent network with low attack complexity, requires no privileges and no user interaction. Impact on confidentiality is none, integrity high, and availability none.

Is CVE-2018-5871 being actively exploited?

It is not currently listed in CISA's KEV catalog. Its EPSS exploit-prediction score is 0% (20th percentile), an estimate of the probability of exploitation in the next 30 days.

What products are affected by CVE-2018-5871?

CVE-2018-5871 primarily affects Qualcomm Mdm9206 Firmware. In total, 31 product configurations (CPEs) are listed as vulnerable; see the affected-products list for the exact versions.

How do I fix CVE-2018-5871?

Review the linked vendor and NVD advisories for patched versions and mitigations, then upgrade or apply the recommended workaround.

When was CVE-2018-5871 published?

CVE-2018-5871 was published on 2018-09-20 and last updated on 2026-06-17.

CVE-2018-5871

CVE-2018-5871 is a medium-severity vulnerability in Qualcomm Mdm9206 Firmware with a CVSS 3.x base score of 6.5. It is not currently listed as actively exploited by CISA, and its EPSS exploit-prediction score is low. The underlying weakness is classified as CWE-338.

Key facts

Severity: Medium (CVSS 3.x base score 6.5)
CVSS v2: 3.3
EPSS exploit prediction: 0% (20th percentile)
Actively exploited: Not listed in CISA KEV
Weakness: CWE-338
Affected product: Qualcomm Mdm9206 Firmware
Published: 2018-09-20
Last modified: 2026-06-17

Description

In Snapdragon (Automobile, Mobile, Wear) in version MDM9206, MDM9607, MDM9640, MDM9650, MSM8996AU, QCA6574AU, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820A, SD 835, SD 845, SD 850, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, SDM710, Snapdragon_High_Med_2016, MAC address randomization performed during probe requests (for privacy reasons) is not done properly due to a flawed RNG which produces repeating output much earlier than expected.

Frequently asked questions

What is CVE-2018-5871?: In Snapdragon (Automobile, Mobile, Wear) in version MDM9206, MDM9607, MDM9640, MDM9650, MSM8996AU, QCA6574AU, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820A, SD 835, SD 845, SD 850, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, SDM710, Snapdragon_High_Med_2016, MAC address randomization performed during probe requests (for privacy reasons) is not done properly due to a flawed RNG which produces repeating output much earlier than expected.
How severe is CVE-2018-5871?: CVE-2018-5871 has a CVSS 3.x base score of 6.5, rated medium severity. It is exploitable over an adjacent network with low attack complexity, requires no privileges and no user interaction. Impact on confidentiality is none, integrity high, and availability none.
Is CVE-2018-5871 being actively exploited?: It is not currently listed in CISA's KEV catalog. Its EPSS exploit-prediction score is 0% (20th percentile), an estimate of the probability of exploitation in the next 30 days.
What products are affected by CVE-2018-5871?: CVE-2018-5871 primarily affects Qualcomm Mdm9206 Firmware. In total, 31 product configurations (CPEs) are listed as vulnerable; see the affected-products list for the exact versions.
How do I fix CVE-2018-5871?: Review the linked vendor and NVD advisories for patched versions and mitigations, then upgrade or apply the recommended workaround.
When was CVE-2018-5871 published?: CVE-2018-5871 was published on 2018-09-20 and last updated on 2026-06-17.

References

Affected products (31)

cpe:2.3:o:qualcomm:mdm9206_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:mdm9607_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:mdm9640_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:mdm9650_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:msm8996au_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qca6574au_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd210_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd212_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd205_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd425_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd427_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd430_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd435_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd450_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd615_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd616_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd415_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd650_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd652_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd820a_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd835_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd845_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd850_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sda660_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sdm429_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sdm439_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sdm630_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sdm632_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sdm636_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sdm660_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sdm710_firmware:-:*:*:*:*:*:*:*

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