How severe is CVE-2019-10495?

CVE-2019-10495 has a CVSS 3.x base score of 7.3, rated high severity. It is exploitable over local access with low attack complexity, requires low privileges and user interaction. Impact on confidentiality is high, integrity high, and availability high.

Is CVE-2019-10495 being actively exploited?

It is not currently listed in CISA's KEV catalog. Its EPSS exploit-prediction score is 0% (9th percentile), an estimate of the probability of exploitation in the next 30 days.

What products are affected by CVE-2019-10495?

CVE-2019-10495 primarily affects Qualcomm Msm8909w Firmware. In total, 36 product configurations (CPEs) are listed as vulnerable; see the affected-products list for the exact versions.

How do I fix CVE-2019-10495?

Review the linked vendor and NVD advisories for patched versions and mitigations, then upgrade or apply the recommended workaround. Given its high severity, prioritise patching exposed systems.

When was CVE-2019-10495 published?

CVE-2019-10495 was published on 2019-11-06 and last updated on 2026-06-17.

CVE-2019-10495

CVE-2019-10495 is a high-severity vulnerability in Qualcomm Msm8909w Firmware with a CVSS 3.x base score of 7.3. It is not currently listed as actively exploited by CISA, and its EPSS exploit-prediction score is low. The underlying weakness is classified as CWE-787.

Key facts

Severity: High (CVSS 3.x base score 7.3)
CVSS v2: 4.6
EPSS exploit prediction: 0% (9th percentile)
Actively exploited: Not listed in CISA KEV
Weakness: CWE-787
Affected product: Qualcomm Msm8909w Firmware
Published: 2019-11-06
Last modified: 2026-06-17

Description

Arbitrary buffer write issue while processing sequence header during HEVC or AVC encoding. in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables in MSM8909W, MSM8996AU, QCS605, Qualcomm 215, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 625, SD 632, SD 636, SD 665, SD 675, SD 712 / SD 710 / SD 670, SD 730, SD 820, SD 820A, SD 835, SD 845 / SD 850, SD 855, SD 8CX, SDA660, SDM439, SDM630, SDM660, Snapdragon_High_Med_2016, SXR1130

Frequently asked questions

What is CVE-2019-10495?: Arbitrary buffer write issue while processing sequence header during HEVC or AVC encoding. in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables in MSM8909W, MSM8996AU, QCS605, Qualcomm 215, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 625, SD 632, SD 636, SD 665, SD 675, SD 712 / SD 710 / SD 670, SD 730, SD 820, SD 820A, SD 835, SD 845 / SD 850, SD 855, SD 8CX, SDA660, SDM439, SDM630, SDM660, Snapdragon_High_Med_2016, SXR1130
How severe is CVE-2019-10495?: CVE-2019-10495 has a CVSS 3.x base score of 7.3, rated high severity. It is exploitable over local access with low attack complexity, requires low privileges and user interaction. Impact on confidentiality is high, integrity high, and availability high.
Is CVE-2019-10495 being actively exploited?: It is not currently listed in CISA's KEV catalog. Its EPSS exploit-prediction score is 0% (9th percentile), an estimate of the probability of exploitation in the next 30 days.
What products are affected by CVE-2019-10495?: CVE-2019-10495 primarily affects Qualcomm Msm8909w Firmware. In total, 36 product configurations (CPEs) are listed as vulnerable; see the affected-products list for the exact versions.
How do I fix CVE-2019-10495?: Review the linked vendor and NVD advisories for patched versions and mitigations, then upgrade or apply the recommended workaround. Given its high severity, prioritise patching exposed systems.
When was CVE-2019-10495 published?: CVE-2019-10495 was published on 2019-11-06 and last updated on 2026-06-17.

References

https://source.android.com/security/bulletin/

Affected products (36)

cpe:2.3:o:qualcomm:msm8909w_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:msm8996au_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qcs605_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qualcomm_215_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_210_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_212_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_205_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_425_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_427_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_430_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_435_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_439_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_429_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_450_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_625_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_632_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_636_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_665_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_675_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_712_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_710_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_670_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_730_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_820_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_820a_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_835_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_845_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_850_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_855_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_8cx_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sda660_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sdm439_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sdm630_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sdm660_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:snapdragon_high_med_2016_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sxr1130_firmware:-:*:*:*:*:*:*:*

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