How severe is CVE-2019-10537?

CVE-2019-10537 has a CVSS 3.x base score of 7.8, rated high severity. It is exploitable over local access with low attack complexity, requires low privileges and no user interaction. Impact on confidentiality is high, integrity high, and availability high.

Is CVE-2019-10537 being actively exploited?

It is not currently listed in CISA's KEV catalog. Its EPSS exploit-prediction score is 0% (10th percentile), an estimate of the probability of exploitation in the next 30 days.

What products are affected by CVE-2019-10537?

CVE-2019-10537 primarily affects Qualcomm Mdm9607 Firmware. In total, 15 product configurations (CPEs) are listed as vulnerable; see the affected-products list for the exact versions.

How do I fix CVE-2019-10537?

Review the linked vendor and NVD advisories for patched versions and mitigations, then upgrade or apply the recommended workaround. Given its high severity, prioritise patching exposed systems.

When was CVE-2019-10537 published?

CVE-2019-10537 was published on 2019-12-18 and last updated on 2026-06-17.

CVE-2019-10537

CVE-2019-10537 is a high-severity vulnerability in Qualcomm Mdm9607 Firmware with a CVSS 3.x base score of 7.8. It is not currently listed as actively exploited by CISA, and its EPSS exploit-prediction score is low. The underlying weakness is classified as CWE-190.

Key facts

Severity: High (CVSS 3.x base score 7.8)
CVSS v2: 7.2
EPSS exploit prediction: 0% (10th percentile)
Actively exploited: Not listed in CISA KEV
Weakness: CWE-190
Affected product: Qualcomm Mdm9607 Firmware
Published: 2019-12-18
Last modified: 2026-06-17

Description

Improper validation of event buffer extracted from FW response can lead to integer overflow, which will allow to pass the length check and eventually will lead to buffer overwrite when event data is copied to context buffer in Snapdragon Auto, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music in MDM9607, Nicobar, QCA6574AU, QCN7605, QCS405, QCS605, SDM660, SDM845, SDX55, SM6150, SM7150, SM8150, SM8250, SXR1130, SXR2130

Frequently asked questions

What is CVE-2019-10537?: Improper validation of event buffer extracted from FW response can lead to integer overflow, which will allow to pass the length check and eventually will lead to buffer overwrite when event data is copied to context buffer in Snapdragon Auto, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music in MDM9607, Nicobar, QCA6574AU, QCN7605, QCS405, QCS605, SDM660, SDM845, SDX55, SM6150, SM7150, SM8150, SM8250, SXR1130, SXR2130
How severe is CVE-2019-10537?: CVE-2019-10537 has a CVSS 3.x base score of 7.8, rated high severity. It is exploitable over local access with low attack complexity, requires low privileges and no user interaction. Impact on confidentiality is high, integrity high, and availability high.
Is CVE-2019-10537 being actively exploited?: It is not currently listed in CISA's KEV catalog. Its EPSS exploit-prediction score is 0% (10th percentile), an estimate of the probability of exploitation in the next 30 days.
What products are affected by CVE-2019-10537?: CVE-2019-10537 primarily affects Qualcomm Mdm9607 Firmware. In total, 15 product configurations (CPEs) are listed as vulnerable; see the affected-products list for the exact versions.
How do I fix CVE-2019-10537?: Review the linked vendor and NVD advisories for patched versions and mitigations, then upgrade or apply the recommended workaround. Given its high severity, prioritise patching exposed systems.
When was CVE-2019-10537 published?: CVE-2019-10537 was published on 2019-12-18 and last updated on 2026-06-17.

References

https://www.qualcomm.com/company/product-security/bulletins/december-2019-bulletin

Affected products (15)

cpe:2.3:o:qualcomm:mdm9607_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:nicobar_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qca6574au_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qcn7605_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qcs405_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qcs605_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sdm660_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sdm845_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sdx55_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sm6150_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sm7150_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sm8150_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sm8250_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sxr1130_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sxr2130_firmware:-:*:*:*:*:*:*:*

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