How severe is CVE-2019-10606?

CVE-2019-10606 has a CVSS 3.x base score of 7.8, rated high severity. It is exploitable over local access with low attack complexity, requires low privileges and no user interaction. Impact on confidentiality is high, integrity high, and availability high.

Is CVE-2019-10606 being actively exploited?

It is not currently listed in CISA's KEV catalog. Its EPSS exploit-prediction score is 0% (10th percentile), an estimate of the probability of exploitation in the next 30 days.

What products are affected by CVE-2019-10606?

CVE-2019-10606 primarily affects Qualcomm Mdm9607 Firmware. In total, 8 product configurations (CPEs) are listed as vulnerable; see the affected-products list for the exact versions.

How do I fix CVE-2019-10606?

Review the linked vendor and NVD advisories for patched versions and mitigations, then upgrade or apply the recommended workaround. Given its high severity, prioritise patching exposed systems.

When was CVE-2019-10606 published?

CVE-2019-10606 was published on 2020-01-21 and last updated on 2026-06-17.

CVE-2019-10606

CVE-2019-10606 is a high-severity vulnerability in Qualcomm Mdm9607 Firmware with a CVSS 3.x base score of 7.8. It is not currently listed as actively exploited by CISA, and its EPSS exploit-prediction score is low. The underlying weakness is classified as CWE-120.

Key facts

Severity: High (CVSS 3.x base score 7.8)
CVSS v2: 7.2
EPSS exploit prediction: 0% (10th percentile)
Actively exploited: Not listed in CISA KEV
Weakness: CWE-120
Affected product: Qualcomm Mdm9607 Firmware
Published: 2020-01-21
Last modified: 2026-06-17

Description

Out-of-bound access will occur in USB driver due to lack of check to validate the frame size passed by user in Snapdragon Auto, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables in MDM9607, MSM8909W, MSM8917, MSM8920, MSM8937, MSM8940, QCS605, SDX24

Frequently asked questions

What is CVE-2019-10606?: Out-of-bound access will occur in USB driver due to lack of check to validate the frame size passed by user in Snapdragon Auto, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables in MDM9607, MSM8909W, MSM8917, MSM8920, MSM8937, MSM8940, QCS605, SDX24
How severe is CVE-2019-10606?: CVE-2019-10606 has a CVSS 3.x base score of 7.8, rated high severity. It is exploitable over local access with low attack complexity, requires low privileges and no user interaction. Impact on confidentiality is high, integrity high, and availability high.
Is CVE-2019-10606 being actively exploited?: It is not currently listed in CISA's KEV catalog. Its EPSS exploit-prediction score is 0% (10th percentile), an estimate of the probability of exploitation in the next 30 days.
What products are affected by CVE-2019-10606?: CVE-2019-10606 primarily affects Qualcomm Mdm9607 Firmware. In total, 8 product configurations (CPEs) are listed as vulnerable; see the affected-products list for the exact versions.
How do I fix CVE-2019-10606?: Review the linked vendor and NVD advisories for patched versions and mitigations, then upgrade or apply the recommended workaround. Given its high severity, prioritise patching exposed systems.
When was CVE-2019-10606 published?: CVE-2019-10606 was published on 2020-01-21 and last updated on 2026-06-17.

References

https://www.qualcomm.com/company/product-security/bulletins/january-2020-bulletin

Affected products (8)

cpe:2.3:o:qualcomm:mdm9607_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:msm8909w_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:msm8917_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:msm8920_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:msm8937_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:msm8940_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qcs605_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sdx24_firmware:-:*:*:*:*:*:*:*

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