How severe is CVE-2019-14027?

CVE-2019-14027 has a CVSS 3.x base score of 7.8, rated high severity. It is exploitable over local access with low attack complexity, requires low privileges and no user interaction. Impact on confidentiality is high, integrity high, and availability high.

Is CVE-2019-14027 being actively exploited?

It is not currently listed in CISA's KEV catalog. Its EPSS exploit-prediction score is 0% (10th percentile), an estimate of the probability of exploitation in the next 30 days.

What products are affected by CVE-2019-14027?

CVE-2019-14027 primarily affects Qualcomm Apq8098 Firmware. In total, 25 product configurations (CPEs) are listed as vulnerable; see the affected-products list for the exact versions.

How do I fix CVE-2019-14027?

Review the linked vendor and NVD advisories for patched versions and mitigations, then upgrade or apply the recommended workaround. Given its high severity, prioritise patching exposed systems.

When was CVE-2019-14027 published?

CVE-2019-14027 was published on 2020-03-05 and last updated on 2026-06-17.

CVE-2019-14027

CVE-2019-14027 is a high-severity vulnerability in Qualcomm Apq8098 Firmware with a CVSS 3.x base score of 7.8. It is not currently listed as actively exploited by CISA, and its EPSS exploit-prediction score is low. The underlying weakness is classified as CWE-120.

Key facts

Severity: High (CVSS 3.x base score 7.8)
CVSS v2: 7.2
EPSS exploit prediction: 0% (10th percentile)
Actively exploited: Not listed in CISA KEV
Weakness: CWE-120
Affected product: Qualcomm Apq8098 Firmware
Published: 2020-03-05
Last modified: 2026-06-17

Description

Buffer overflow due to lack of upper bound check on channel length which is used for a loop. in Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wired Infrastructure and Networking in APQ8098, IPQ6018, IPQ8074, MSM8998, Nicobar, QCA8081, QCN7605, QCS404, QCS605, Rennell, SC8180X, SDA660, SDA845, SDM630, SDM636, SDM660, SDM670, SDM710, SDM845, SDM850, SM6150, SM7150, SM8150, SXR1130, SXR2130

Frequently asked questions

What is CVE-2019-14027?: Buffer overflow due to lack of upper bound check on channel length which is used for a loop. in Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wired Infrastructure and Networking in APQ8098, IPQ6018, IPQ8074, MSM8998, Nicobar, QCA8081, QCN7605, QCS404, QCS605, Rennell, SC8180X, SDA660, SDA845, SDM630, SDM636, SDM660, SDM670, SDM710, SDM845, SDM850, SM6150, SM7150, SM8150, SXR1130, SXR2130
How severe is CVE-2019-14027?: CVE-2019-14027 has a CVSS 3.x base score of 7.8, rated high severity. It is exploitable over local access with low attack complexity, requires low privileges and no user interaction. Impact on confidentiality is high, integrity high, and availability high.
Is CVE-2019-14027 being actively exploited?: It is not currently listed in CISA's KEV catalog. Its EPSS exploit-prediction score is 0% (10th percentile), an estimate of the probability of exploitation in the next 30 days.
What products are affected by CVE-2019-14027?: CVE-2019-14027 primarily affects Qualcomm Apq8098 Firmware. In total, 25 product configurations (CPEs) are listed as vulnerable; see the affected-products list for the exact versions.
How do I fix CVE-2019-14027?: Review the linked vendor and NVD advisories for patched versions and mitigations, then upgrade or apply the recommended workaround. Given its high severity, prioritise patching exposed systems.
When was CVE-2019-14027 published?: CVE-2019-14027 was published on 2020-03-05 and last updated on 2026-06-17.

References

https://www.qualcomm.com/company/product-security/bulletins/march-2020-bulletin

Affected products (25)

cpe:2.3:o:qualcomm:apq8098_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:ipq6018_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:ipq8074_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:msm8998_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:nicobar_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qca8081_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qcn7605_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qcs404_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qcs605_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:rennell_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sc8180x_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sda660_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sda845_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sdm630_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sdm636_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sdm660_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sdm670_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sdm710_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sdm845_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sdm850_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sm6150_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sm7150_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sm8150_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sxr1130_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sxr2130_firmware:-:*:*:*:*:*:*:*

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