How severe is CVE-2019-2237?

CVE-2019-2237 has a CVSS 3.x base score of 5.5, rated medium severity. It is exploitable over local access with low attack complexity, requires low privileges and no user interaction. Impact on confidentiality is none, integrity high, and availability none.

Is CVE-2019-2237 being actively exploited?

It is not currently listed in CISA's KEV catalog. Its EPSS exploit-prediction score is 0% (8th percentile), an estimate of the probability of exploitation in the next 30 days.

What products are affected by CVE-2019-2237?

CVE-2019-2237 primarily affects Qualcomm Mdm9206 Firmware. In total, 17 product configurations (CPEs) are listed as vulnerable; see the affected-products list for the exact versions.

How do I fix CVE-2019-2237?

Review the linked vendor and NVD advisories for patched versions and mitigations, then upgrade or apply the recommended workaround.

When was CVE-2019-2237 published?

CVE-2019-2237 was published on 2019-07-25 and last updated on 2026-06-17.

CVE-2019-2237

CVE-2019-2237 is a medium-severity vulnerability in Qualcomm Mdm9206 Firmware with a CVSS 3.x base score of 5.5. It is not currently listed as actively exploited by CISA, and its EPSS exploit-prediction score is low. The underlying weakness is classified as CWE-388.

Key facts

Severity: Medium (CVSS 3.x base score 5.5)
CVSS v2: 2.1
EPSS exploit prediction: 0% (8th percentile)
Actively exploited: Not listed in CISA KEV
Weakness: CWE-388
Affected product: Qualcomm Mdm9206 Firmware
Published: 2019-07-25
Last modified: 2026-06-17

Description

Failure in taking appropriate action to handle the error case If keypad gpio deactivation fails leads to silent failure scenario and subsequent logic gets executed everytime in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile in MDM9206, MDM9607, MDM9650, MDM9655, QCS605, SD 210/SD 212/SD 205, SD 410/12, SD 675, SD 712 / SD 710 / SD 670, SD 730, SD 8CX, SXR1130

Frequently asked questions

What is CVE-2019-2237?: Failure in taking appropriate action to handle the error case If keypad gpio deactivation fails leads to silent failure scenario and subsequent logic gets executed everytime in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile in MDM9206, MDM9607, MDM9650, MDM9655, QCS605, SD 210/SD 212/SD 205, SD 410/12, SD 675, SD 712 / SD 710 / SD 670, SD 730, SD 8CX, SXR1130
How severe is CVE-2019-2237?: CVE-2019-2237 has a CVSS 3.x base score of 5.5, rated medium severity. It is exploitable over local access with low attack complexity, requires low privileges and no user interaction. Impact on confidentiality is none, integrity high, and availability none.
Is CVE-2019-2237 being actively exploited?: It is not currently listed in CISA's KEV catalog. Its EPSS exploit-prediction score is 0% (8th percentile), an estimate of the probability of exploitation in the next 30 days.
What products are affected by CVE-2019-2237?: CVE-2019-2237 primarily affects Qualcomm Mdm9206 Firmware. In total, 17 product configurations (CPEs) are listed as vulnerable; see the affected-products list for the exact versions.
How do I fix CVE-2019-2237?: Review the linked vendor and NVD advisories for patched versions and mitigations, then upgrade or apply the recommended workaround.
When was CVE-2019-2237 published?: CVE-2019-2237 was published on 2019-07-25 and last updated on 2026-06-17.

References

https://www.qualcomm.com/company/product-security/bulletins

Affected products (17)

cpe:2.3:o:qualcomm:mdm9206_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:mdm9607_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:mdm9650_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:mdm9655_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qcs605_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_210_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_212_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_205_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_410_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_412_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_675_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_712_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_710_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_670_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_730_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_8cx_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sxr1130_firmware:-:*:*:*:*:*:*:*

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CVE-2016-10414 — Critical (CVSS 9.8): In Android before 2018-04-05 or earlier security patch level on Qualcomm Small Cell SoC, Snapdragon Automobile,…
CVE-2015-9120 — Critical (CVSS 9.8): In Android before 2018-04-05 or earlier security patch level on Qualcomm Snapdragon Automobile, Snapdragon Mobile, and…
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