CVE-2019-2255

CVE-2019-2255 is a critical-severity vulnerability in Qualcomm Msm8909w Firmware with a CVSS 3.x base score of 9.8. It is not currently listed as actively exploited by CISA, and its EPSS exploit-prediction score is low.

Key facts

• Severity: Critical (CVSS 3.x base score 9.8)
• CVSS v2: 10.0
• EPSS exploit prediction: 2% (72nd percentile)
• Actively exploited: Not listed in CISA KEV
• Affected product: Qualcomm Msm8909w Firmware
• Published: 2019-06-14
• Last modified: 2026-06-17

Description

An unprivileged user can craft a bitstream such that the payload encoded in the bitstream gains code execution in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables in MSM8909W, MSM8996AU, QCS605, Qualcomm 215, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 625, SD 632, SD 636, SD 675, SD 712 / SD 710 / SD 670, SD 730, SD 820, SD 820A, SD 835, SD 845 / SD 850, SD 855, SD 8CX, SDA660, SDM439, SDM630, SDM660, Snapdragon_High_Med_2016, SXR1130

Frequently asked questions

What is CVE-2019-2255?

An unprivileged user can craft a bitstream such that the payload encoded in the bitstream gains code execution in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables in MSM8909W, MSM8996AU, QCS605, Qualcomm 215, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 625, SD 632, SD 636, SD 675, SD 712 / SD 710 / SD 670, SD 730, SD 820, SD 820A, SD 835, SD 845 / SD 850, SD 855, SD 8CX, SDA660, SDM439, SDM630, SDM660, Snapdragon_High_Med_2016, SXR1130

How severe is CVE-2019-2255?

CVE-2019-2255 has a CVSS 3.x base score of 9.8, rated critical severity. It is exploitable over network with low attack complexity, requires no privileges and no user interaction. Impact on confidentiality is high, integrity high, and availability high.

Is CVE-2019-2255 being actively exploited?

It is not currently listed in CISA's KEV catalog. Its EPSS exploit-prediction score is 2% (72nd percentile), an estimate of the probability of exploitation in the next 30 days.

What products are affected by CVE-2019-2255?

CVE-2019-2255 primarily affects Qualcomm Msm8909w Firmware. In total, 35 product configurations (CPEs) are listed as vulnerable; see the affected-products list for the exact versions.

How do I fix CVE-2019-2255?

Review the linked vendor and NVD advisories for patched versions and mitigations, then upgrade or apply the recommended workaround. Given its critical severity, prioritise patching exposed systems.

When was CVE-2019-2255 published?

CVE-2019-2255 was published on 2019-06-14 and last updated on 2026-06-17.

References

• https://www.qualcomm.com/company/product-security/bulletins

Affected products (35)

• cpe:2.3:o:qualcomm:msm8909w_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:msm8996au_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:qcs605_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:qm215_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:sd_210_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:sd_212_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:sd_205_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:sd_425_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:sd_427_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:sd_430_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:sd_435_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:sd_439_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:sd_429_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:sd_450_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:sd_625_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:sd_632_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:sd_636_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:sd_675_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:sd_712_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:sd_710_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:sd_670_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:sd_730_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:sd_820_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:sd_820a_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:sd_835_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:sd_845_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:sd_850_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:sd_855_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:sd_8cx_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:sda660_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:sdm439_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:sdm630_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:sdm660_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:snapdragon_high_med_2016_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:sxr1130_firmware:-:*:*:*:*:*:*:*

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