How severe is CVE-2019-2290?

CVE-2019-2290 has a CVSS 3.x base score of 7.8, rated high severity. It is exploitable over local access with low attack complexity, requires low privileges and no user interaction. Impact on confidentiality is high, integrity high, and availability high.

Is CVE-2019-2290 being actively exploited?

It is not currently listed in CISA's KEV catalog. Its EPSS exploit-prediction score is 0% (10th percentile), an estimate of the probability of exploitation in the next 30 days.

What products are affected by CVE-2019-2290?

CVE-2019-2290 primarily affects Qualcomm Mdm9206 Firmware. In total, 28 product configurations (CPEs) are listed as vulnerable; see the affected-products list for the exact versions.

How do I fix CVE-2019-2290?

Review the linked vendor and NVD advisories for patched versions and mitigations, then upgrade or apply the recommended workaround. Given its high severity, prioritise patching exposed systems.

When was CVE-2019-2290 published?

CVE-2019-2290 was published on 2019-07-25 and last updated on 2026-06-17.

CVE-2019-2290

CVE-2019-2290 is a high-severity vulnerability in Qualcomm Mdm9206 Firmware with a CVSS 3.x base score of 7.8. It is not currently listed as actively exploited by CISA, and its EPSS exploit-prediction score is low. The underlying weakness is classified as CWE-416.

Key facts

Severity: High (CVSS 3.x base score 7.8)
CVSS v2: 4.6
EPSS exploit prediction: 0% (10th percentile)
Actively exploited: Not listed in CISA KEV
Weakness: CWE-416
Affected product: Qualcomm Mdm9206 Firmware
Published: 2019-07-25
Last modified: 2026-06-17

Description

Multiple open and close from multiple threads will lead camera driver to access destroyed session data pointer in Snapdragon Auto, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables in MDM9206, MDM9607, MDM9640, MDM9650, MSM8909W, MSM8996AU, QCS605, SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 636, SD 650/52, SD 712 / SD 710 / SD 670, SD 820, SD 820A, SD 835, SD 845 / SD 850, SDM660, SDX20, SDX24, Snapdragon_High_Med_2016

Frequently asked questions

What is CVE-2019-2290?: Multiple open and close from multiple threads will lead camera driver to access destroyed session data pointer in Snapdragon Auto, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables in MDM9206, MDM9607, MDM9640, MDM9650, MSM8909W, MSM8996AU, QCS605, SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 636, SD 650/52, SD 712 / SD 710 / SD 670, SD 820, SD 820A, SD 835, SD 845 / SD 850, SDM660, SDX20, SDX24, Snapdragon_High_Med_2016
How severe is CVE-2019-2290?: CVE-2019-2290 has a CVSS 3.x base score of 7.8, rated high severity. It is exploitable over local access with low attack complexity, requires low privileges and no user interaction. Impact on confidentiality is high, integrity high, and availability high.
Is CVE-2019-2290 being actively exploited?: It is not currently listed in CISA's KEV catalog. Its EPSS exploit-prediction score is 0% (10th percentile), an estimate of the probability of exploitation in the next 30 days.
What products are affected by CVE-2019-2290?: CVE-2019-2290 primarily affects Qualcomm Mdm9206 Firmware. In total, 28 product configurations (CPEs) are listed as vulnerable; see the affected-products list for the exact versions.
How do I fix CVE-2019-2290?: Review the linked vendor and NVD advisories for patched versions and mitigations, then upgrade or apply the recommended workaround. Given its high severity, prioritise patching exposed systems.
When was CVE-2019-2290 published?: CVE-2019-2290 was published on 2019-07-25 and last updated on 2026-06-17.

References

https://www.codeaurora.org/security-bulletin/2019/07/01/july-2019-code-aurora-security-bulletin

Affected products (28)

cpe:2.3:o:qualcomm:mdm9206_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:mdm9607_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:mdm9640_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:mdm9650_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:msm8909w_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:msm8996au_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qcs605_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_425_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_427_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_430_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_435_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_450_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_625_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_636_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_650_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_652_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_712_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_710_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_670_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_820_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_820a_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_835_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_845_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_850_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sdm660_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sdx20_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sdx24_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:snapdragon_high_med_2016_firmware:-:*:*:*:*:*:*:*

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