How severe is CVE-2019-2333?

CVE-2019-2333 has a CVSS 3.x base score of 7.8, rated high severity. It is exploitable over local access with low attack complexity, requires low privileges and no user interaction. Impact on confidentiality is high, integrity high, and availability high.

Is CVE-2019-2333 being actively exploited?

It is not currently listed in CISA's KEV catalog. Its EPSS exploit-prediction score is 0% (9th percentile), an estimate of the probability of exploitation in the next 30 days.

What products are affected by CVE-2019-2333?

CVE-2019-2333 primarily affects Qualcomm Mdm9150 Firmware. In total, 38 product configurations (CPEs) are listed as vulnerable; see the affected-products list for the exact versions.

How do I fix CVE-2019-2333?

Review the linked vendor and NVD advisories for patched versions and mitigations, then upgrade or apply the recommended workaround. Given its high severity, prioritise patching exposed systems.

When was CVE-2019-2333 published?

CVE-2019-2333 was published on 2019-09-30 and last updated on 2026-06-17.

CVE-2019-2333

CVE-2019-2333 is a high-severity vulnerability in Qualcomm Mdm9150 Firmware with a CVSS 3.x base score of 7.8. It is not currently listed as actively exploited by CISA, and its EPSS exploit-prediction score is low. The underlying weakness is classified as CWE-120.

Key facts

Severity: High (CVSS 3.x base score 7.8)
CVSS v2: 4.6
EPSS exploit prediction: 0% (9th percentile)
Actively exploited: Not listed in CISA KEV
Weakness: CWE-120
Affected product: Qualcomm Mdm9150 Firmware
Published: 2019-09-30
Last modified: 2026-06-17

Description

Buffer overflow due to improper validation of buffer size while IPA driver processing to perform read operation in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables in MDM9150, MDM9607, MDM9650, MSM8909W, MSM8996AU, QCS605, Qualcomm 215, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 625, SD 632, SD 636, SD 665, SD 675, SD 712 / SD 710 / SD 670, SD 730, SD 820, SD 820A, SD 835, SD 845 / SD 850, SD 855, SDA660, SDM439, SDM630, SDM660, SDX20, SDX24

Frequently asked questions

What is CVE-2019-2333?: Buffer overflow due to improper validation of buffer size while IPA driver processing to perform read operation in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables in MDM9150, MDM9607, MDM9650, MSM8909W, MSM8996AU, QCS605, Qualcomm 215, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 625, SD 632, SD 636, SD 665, SD 675, SD 712 / SD 710 / SD 670, SD 730, SD 820, SD 820A, SD 835, SD 845 / SD 850, SD 855, SDA660, SDM439, SDM630, SDM660, SDX20, SDX24
How severe is CVE-2019-2333?: CVE-2019-2333 has a CVSS 3.x base score of 7.8, rated high severity. It is exploitable over local access with low attack complexity, requires low privileges and no user interaction. Impact on confidentiality is high, integrity high, and availability high.
Is CVE-2019-2333 being actively exploited?: It is not currently listed in CISA's KEV catalog. Its EPSS exploit-prediction score is 0% (9th percentile), an estimate of the probability of exploitation in the next 30 days.
What products are affected by CVE-2019-2333?: CVE-2019-2333 primarily affects Qualcomm Mdm9150 Firmware. In total, 38 product configurations (CPEs) are listed as vulnerable; see the affected-products list for the exact versions.
How do I fix CVE-2019-2333?: Review the linked vendor and NVD advisories for patched versions and mitigations, then upgrade or apply the recommended workaround. Given its high severity, prioritise patching exposed systems.
When was CVE-2019-2333 published?: CVE-2019-2333 was published on 2019-09-30 and last updated on 2026-06-17.

References

https://www.codeaurora.org/security-bulletin/2019/08/05/august-2019-code-aurora-security-bulletin

Affected products (38)

cpe:2.3:o:qualcomm:mdm9150_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:mdm9607_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:mdm9650_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:msm8909w_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:msm8996au_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qcs605_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qualcomm_215_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_210_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_212_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_205_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_425_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_427_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_430_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_435_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_439_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_429_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_450_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_625_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_632_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_636_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_665_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_675_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_712_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_710_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_670_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_730_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_820_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_820a_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_835_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_845_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_850_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_855_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sda660_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sdm439_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sdm630_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sdm660_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sdx20_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sdx24_firmware:-:*:*:*:*:*:*:*

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