CVE-2020-11127
CVE-2020-11127 is a high-severity vulnerability in Qualcomm Mdm9205 Firmware with a CVSS 3.x base score of 7.8. It is not currently listed as actively exploited by CISA, and its EPSS exploit-prediction score is low. The underlying weakness is classified as CWE-190.
Key facts
- Severity: High (CVSS 3.x base score 7.8)
- CVSS v2: 7.2
- EPSS exploit prediction: 0% (10th percentile)
- Actively exploited: Not listed in CISA KEV
- Weakness: CWE-190
- Affected product: Qualcomm Mdm9205 Firmware
- Published:
- Last modified:
Description
u'Integer overflow can cause a buffer overflow due to lack of table length check in the extensible boot Loader during the validation of security metadata while processing objects to be loaded' in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking in MDM9205, QCM4290, QCS405, QCS410, QCS4290, QCS610, QSM8250, SA415M, SA515M, SA6145P, SA6150P, SA6155, SA6155P, SA8150P, SA8155, SA8155P, SA8195P, SC7180, SC8180X, SC8180X+SDX55, SC8180XP, SDA640, SDA845, SDA855, SDM1000, SDM640, SDM830, SDM845, SDM850, SDX24, SDX50M, SDX55, SDX55M, SM4125, SM4250, SM4250P, SM6115, SM6115P, SM6150, SM6150P, SM6250, SM6250P, SM6350, SM7125, SM7150, SM7150P, SM7225, SM7250, SM7250P, SM8150, SM8150P, SM8250, SXR2130, SXR2130P
Frequently asked questions
- What is CVE-2020-11127?
- u'Integer overflow can cause a buffer overflow due to lack of table length check in the extensible boot Loader during the validation of security metadata while processing objects to be loaded' in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking in MDM9205, QCM4290, QCS405, QCS410, QCS4290, QCS610, QSM8250, SA415M, SA515M, SA6145P, SA6150P, SA6155, SA6155P, SA8150P, SA8155, SA8155P, SA8195P, SC7180, SC8180X, SC8180X+SDX55, SC8180XP, SDA640, SDA845, SDA855, SDM1000, SDM640, SDM830, SDM845, SDM850, SDX24, SDX50M, SDX55, SDX55M, SM4125, SM4250, SM4250P, SM6115, SM6115P, SM6150, SM6150P, SM6250, SM6250P, SM6350, SM7125, SM7150, SM7150P, SM7225, SM7250, SM7250P, SM8150, SM8150P, SM8250, SXR2130, SXR2130P
- How severe is CVE-2020-11127?
- CVE-2020-11127 has a CVSS 3.x base score of 7.8, rated high severity. It is exploitable over local access with low attack complexity, requires low privileges and no user interaction. Impact on confidentiality is high, integrity high, and availability high.
- Is CVE-2020-11127 being actively exploited?
- It is not currently listed in CISA's KEV catalog. Its EPSS exploit-prediction score is 0% (10th percentile), an estimate of the probability of exploitation in the next 30 days.
- What products are affected by CVE-2020-11127?
- CVE-2020-11127 primarily affects Qualcomm Mdm9205 Firmware. In total, 53 product configurations (CPEs) are listed as vulnerable; see the affected-products list for the exact versions.
- How do I fix CVE-2020-11127?
- Review the linked vendor and NVD advisories for patched versions and mitigations, then upgrade or apply the recommended workaround. Given its high severity, prioritise patching exposed systems.
- When was CVE-2020-11127 published?
- CVE-2020-11127 was published on 2020-11-12 and last updated on 2026-06-17.
References
Affected products (53)
- cpe:2.3:o:qualcomm:mdm9205_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qcm4290_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qcs405_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qcs410_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qcs4290_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qcs610_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qsm8250_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa415m_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa515m_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa6145p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa6150p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa6155_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa6155p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa8150p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa8155_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa8155p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa8195p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sc7180_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sc8180x_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sdx55_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sc8180xp_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sda640_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sda845_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sda855_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sdm1000_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sdm640_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sdm830_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sdm845_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sdm850_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sdx24_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sdx50m_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sdx55m_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sm4125_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sm4250_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sm4250p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sm6115_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sm6115p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sm6150_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sm6150p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sm6250_firmware:-:*:*:*:*:*:*:*
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