How severe is CVE-2020-11144?

CVE-2020-11144 has a CVSS 3.x base score of 9.1, rated critical severity. It is exploitable over network with low attack complexity, requires no privileges and no user interaction. Impact on confidentiality is high, integrity none, and availability high.

Is CVE-2020-11144 being actively exploited?

It is not currently listed in CISA's KEV catalog. Its EPSS exploit-prediction score is 1% (55th percentile), an estimate of the probability of exploitation in the next 30 days.

What products are affected by CVE-2020-11144?

CVE-2020-11144 primarily affects Qualcomm Apq8009. In total, 414 product configurations (CPEs) are listed as vulnerable; see the affected-products list for the exact versions.

How do I fix CVE-2020-11144?

Review the linked vendor and NVD advisories for patched versions and mitigations, then upgrade or apply the recommended workaround. Given its critical severity, prioritise patching exposed systems.

When was CVE-2020-11144 published?

CVE-2020-11144 was published on 2021-01-21 and last updated on 2026-06-17.

CVE-2020-11144

CVE-2020-11144 is a critical-severity vulnerability in Qualcomm Apq8009 with a CVSS 3.x base score of 9.1. It is not currently listed as actively exploited by CISA, and its EPSS exploit-prediction score is low. The underlying weakness is classified as CWE-20.

Key facts

Severity: Critical (CVSS 3.x base score 9.1)
CVSS v2: 6.4
EPSS exploit prediction: 1% (55th percentile)
Actively exploited: Not listed in CISA KEV
Weakness: CWE-20
Affected product: Qualcomm Apq8009
Published: 2021-01-21
Last modified: 2026-06-17

Description

Buffer over-read while UE process invalid DL ROHC packet for decompression due to lack of check of size of compresses packet in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables

Frequently asked questions

What is CVE-2020-11144?: Buffer over-read while UE process invalid DL ROHC packet for decompression due to lack of check of size of compresses packet in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables
How severe is CVE-2020-11144?: CVE-2020-11144 has a CVSS 3.x base score of 9.1, rated critical severity. It is exploitable over network with low attack complexity, requires no privileges and no user interaction. Impact on confidentiality is high, integrity none, and availability high.
Is CVE-2020-11144 being actively exploited?: It is not currently listed in CISA's KEV catalog. Its EPSS exploit-prediction score is 1% (55th percentile), an estimate of the probability of exploitation in the next 30 days.
What products are affected by CVE-2020-11144?: CVE-2020-11144 primarily affects Qualcomm Apq8009. In total, 414 product configurations (CPEs) are listed as vulnerable; see the affected-products list for the exact versions.
How do I fix CVE-2020-11144?: Review the linked vendor and NVD advisories for patched versions and mitigations, then upgrade or apply the recommended workaround. Given its critical severity, prioritise patching exposed systems.
When was CVE-2020-11144 published?: CVE-2020-11144 was published on 2021-01-21 and last updated on 2026-06-17.

References

Affected products (414)

cpe:2.3:h:qualcomm:apq8009:-:*:*:*:*:*:*:*
cpe:2.3:h:qualcomm:apq8009w:-:*:*:*:*:*:*:*
cpe:2.3:h:qualcomm:apq8017:-:*:*:*:*:*:*:*
cpe:2.3:h:qualcomm:apq8037:-:*:*:*:*:*:*:*
cpe:2.3:h:qualcomm:apq8053:-:*:*:*:*:*:*:*
cpe:2.3:h:qualcomm:apq8084:-:*:*:*:*:*:*:*
cpe:2.3:h:qualcomm:apq8096au:-:*:*:*:*:*:*:*
cpe:2.3:h:qualcomm:aqt1000:-:*:*:*:*:*:*:*
cpe:2.3:h:qualcomm:ar6003:-:*:*:*:*:*:*:*
cpe:2.3:h:qualcomm:ar8035:-:*:*:*:*:*:*:*
cpe:2.3:h:qualcomm:ar8151:-:*:*:*:*:*:*:*
cpe:2.3:h:qualcomm:csr6030:-:*:*:*:*:*:*:*
cpe:2.3:h:qualcomm:csrb31024:-:*:*:*:*:*:*:*
cpe:2.3:h:qualcomm:fsm10055:-:*:*:*:*:*:*:*
cpe:2.3:h:qualcomm:mdm8207:-:*:*:*:*:*:*:*
cpe:2.3:h:qualcomm:mdm8215:-:*:*:*:*:*:*:*
cpe:2.3:h:qualcomm:mdm8215m:-:*:*:*:*:*:*:*
cpe:2.3:h:qualcomm:mdm8615m:-:*:*:*:*:*:*:*
cpe:2.3:h:qualcomm:mdm9150:-:*:*:*:*:*:*:*
cpe:2.3:h:qualcomm:mdm9205:-:*:*:*:*:*:*:*
cpe:2.3:h:qualcomm:mdm9206:-:*:*:*:*:*:*:*
cpe:2.3:h:qualcomm:mdm9207:-:*:*:*:*:*:*:*
cpe:2.3:h:qualcomm:mdm9215:-:*:*:*:*:*:*:*
cpe:2.3:h:qualcomm:mdm9230:-:*:*:*:*:*:*:*
cpe:2.3:h:qualcomm:mdm9250:-:*:*:*:*:*:*:*
cpe:2.3:h:qualcomm:mdm9310:-:*:*:*:*:*:*:*
cpe:2.3:h:qualcomm:mdm9330:-:*:*:*:*:*:*:*
cpe:2.3:h:qualcomm:mdm9607:-:*:*:*:*:*:*:*
cpe:2.3:h:qualcomm:mdm9615:-:*:*:*:*:*:*:*
cpe:2.3:h:qualcomm:mdm9615m:-:*:*:*:*:*:*:*
cpe:2.3:h:qualcomm:mdm9625:-:*:*:*:*:*:*:*
cpe:2.3:h:qualcomm:mdm9628:-:*:*:*:*:*:*:*
cpe:2.3:h:qualcomm:mdm9630:-:*:*:*:*:*:*:*
cpe:2.3:h:qualcomm:mdm9635m:-:*:*:*:*:*:*:*
cpe:2.3:h:qualcomm:mdm9640:-:*:*:*:*:*:*:*
cpe:2.3:h:qualcomm:mdm9645:-:*:*:*:*:*:*:*
cpe:2.3:h:qualcomm:mdm9650:-:*:*:*:*:*:*:*
cpe:2.3:h:qualcomm:mdm9655:-:*:*:*:*:*:*:*
cpe:2.3:h:qualcomm:msm8108:-:*:*:*:*:*:*:*
cpe:2.3:h:qualcomm:msm8208:-:*:*:*:*:*:*:*

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