How severe is CVE-2020-11156?

CVE-2020-11156 has a CVSS 3.x base score of 8.1, rated high severity. It is exploitable over an adjacent network with low attack complexity, requires no privileges and no user interaction. Impact on confidentiality is high, integrity none, and availability high.

Is CVE-2020-11156 being actively exploited?

It is not currently listed in CISA's KEV catalog. Its EPSS exploit-prediction score is 0% (34th percentile), an estimate of the probability of exploitation in the next 30 days.

What products are affected by CVE-2020-11156?

CVE-2020-11156 primarily affects Qualcomm Qca6390 Firmware. In total, 8 product configurations (CPEs) are listed as vulnerable; see the affected-products list for the exact versions.

How do I fix CVE-2020-11156?

Review the linked vendor and NVD advisories for patched versions and mitigations, then upgrade or apply the recommended workaround. Given its high severity, prioritise patching exposed systems.

When was CVE-2020-11156 published?

CVE-2020-11156 was published on 2020-11-02 and last updated on 2026-06-17.

CVE-2020-11156

CVE-2020-11156 is a high-severity vulnerability in Qualcomm Qca6390 Firmware with a CVSS 3.x base score of 8.1. It is not currently listed as actively exploited by CISA, and its EPSS exploit-prediction score is low. The underlying weakness is classified as CWE-20.

Key facts

Severity: High (CVSS 3.x base score 8.1)
CVSS v2: 4.8
EPSS exploit prediction: 0% (34th percentile)
Actively exploited: Not listed in CISA KEV
Weakness: CWE-20
Affected product: Qualcomm Qca6390 Firmware
Published: 2020-11-02
Last modified: 2026-06-17

Description

u'Buffer over-read issue in Bluetooth estack due to lack of check for invalid length of L2cap packet received from peer device.' in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking in QCA6390, QCN7605, QCS404, SA415M, SA515M, SC8180X, SDX55, SM8250

Frequently asked questions

What is CVE-2020-11156?: u'Buffer over-read issue in Bluetooth estack due to lack of check for invalid length of L2cap packet received from peer device.' in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking in QCA6390, QCN7605, QCS404, SA415M, SA515M, SC8180X, SDX55, SM8250
How severe is CVE-2020-11156?: CVE-2020-11156 has a CVSS 3.x base score of 8.1, rated high severity. It is exploitable over an adjacent network with low attack complexity, requires no privileges and no user interaction. Impact on confidentiality is high, integrity none, and availability high.
Is CVE-2020-11156 being actively exploited?: It is not currently listed in CISA's KEV catalog. Its EPSS exploit-prediction score is 0% (34th percentile), an estimate of the probability of exploitation in the next 30 days.
What products are affected by CVE-2020-11156?: CVE-2020-11156 primarily affects Qualcomm Qca6390 Firmware. In total, 8 product configurations (CPEs) are listed as vulnerable; see the affected-products list for the exact versions.
How do I fix CVE-2020-11156?: Review the linked vendor and NVD advisories for patched versions and mitigations, then upgrade or apply the recommended workaround. Given its high severity, prioritise patching exposed systems.
When was CVE-2020-11156 published?: CVE-2020-11156 was published on 2020-11-02 and last updated on 2026-06-17.

References

Affected products (8)

cpe:2.3:o:qualcomm:qca6390_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qcn7605_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qcs404_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sa415m_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sa515m_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sc8180x_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sdx55_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sm8250_firmware:-:*:*:*:*:*:*:*

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