How severe is CVE-2020-11233?

CVE-2020-11233 has a CVSS 3.x base score of 7.0, rated high severity. It is exploitable over local access with high attack complexity, requires low privileges and no user interaction. Impact on confidentiality is high, integrity high, and availability high.

Is CVE-2020-11233 being actively exploited?

It is not currently listed in CISA's KEV catalog. Its EPSS exploit-prediction score is 0% (3rd percentile), an estimate of the probability of exploitation in the next 30 days.

What products are affected by CVE-2020-11233?

CVE-2020-11233 primarily affects Qualcomm Apq8009 Firmware. In total, 112 product configurations (CPEs) are listed as vulnerable; see the affected-products list for the exact versions.

How do I fix CVE-2020-11233?

Review the linked vendor and NVD advisories for patched versions and mitigations, then upgrade or apply the recommended workaround. Given its high severity, prioritise patching exposed systems.

When was CVE-2020-11233 published?

CVE-2020-11233 was published on 2021-06-09 and last updated on 2026-06-17.

CVE-2020-11233

CVE-2020-11233 is a high-severity vulnerability in Qualcomm Apq8009 Firmware with a CVSS 3.x base score of 7.0. It is not currently listed as actively exploited by CISA, and its EPSS exploit-prediction score is low. The underlying weakness is classified as CWE-367.

Key facts

Severity: High (CVSS 3.x base score 7.0)
CVSS v2: 6.9
EPSS exploit prediction: 0% (3rd percentile)
Actively exploited: Not listed in CISA KEV
Weakness: CWE-367
Affected product: Qualcomm Apq8009 Firmware
Published: 2021-06-09
Last modified: 2026-06-17

Description

Time-of-check time-of-use race condition While processing partition entries due to newly created buffer was read again from mmc without validation in Snapdragon Auto, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables

Frequently asked questions

What is CVE-2020-11233?: Time-of-check time-of-use race condition While processing partition entries due to newly created buffer was read again from mmc without validation in Snapdragon Auto, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables
How severe is CVE-2020-11233?: CVE-2020-11233 has a CVSS 3.x base score of 7.0, rated high severity. It is exploitable over local access with high attack complexity, requires low privileges and no user interaction. Impact on confidentiality is high, integrity high, and availability high.
Is CVE-2020-11233 being actively exploited?: It is not currently listed in CISA's KEV catalog. Its EPSS exploit-prediction score is 0% (3rd percentile), an estimate of the probability of exploitation in the next 30 days.
What products are affected by CVE-2020-11233?: CVE-2020-11233 primarily affects Qualcomm Apq8009 Firmware. In total, 112 product configurations (CPEs) are listed as vulnerable; see the affected-products list for the exact versions.
How do I fix CVE-2020-11233?: Review the linked vendor and NVD advisories for patched versions and mitigations, then upgrade or apply the recommended workaround. Given its high severity, prioritise patching exposed systems.
When was CVE-2020-11233 published?: CVE-2020-11233 was published on 2021-06-09 and last updated on 2026-06-17.

References

https://www.qualcomm.com/company/product-security/bulletins/january-2021-bulletin

Affected products (112)

cpe:2.3:o:qualcomm:apq8009_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:apq8009w_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:apq8017_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:apq8053_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:apq8076_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:apq8096au_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:csr6030_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:mdm9206_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:mdm9230_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:mdm9250_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:mdm9330_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:mdm9607_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:mdm9626_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:mdm9628_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:mdm9630_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:mdm9640_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:mdm9650_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:mdm9655_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:msm8909w_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:msm8937_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:msm8996au_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:pm215_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:pm439_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:pm660_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:pm8004_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:pm8909_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:pm8916_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:pm8937_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:pm8952_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:pm8953_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:pm8956_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:pm8996_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:pmd9607_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:pmd9635_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:pmd9645_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:pmd9655_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:pmi632_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:pmi8937_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:pmi8952_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:pmi8994_firmware:-:*:*:*:*:*:*:*

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