How severe is CVE-2020-11255?

CVE-2020-11255 has a CVSS 3.x base score of 7.5, rated high severity. It is exploitable over network with low attack complexity, requires no privileges and no user interaction. Impact on confidentiality is none, integrity none, and availability high.

Is CVE-2020-11255 being actively exploited?

It is not currently listed in CISA's KEV catalog. Its EPSS exploit-prediction score is 1% (49th percentile), an estimate of the probability of exploitation in the next 30 days.

What products are affected by CVE-2020-11255?

CVE-2020-11255 primarily affects Qualcomm Apq8009 Firmware. In total, 344 product configurations (CPEs) are listed as vulnerable; see the affected-products list for the exact versions.

How do I fix CVE-2020-11255?

Review the linked vendor and NVD advisories for patched versions and mitigations, then upgrade or apply the recommended workaround. Given its high severity, prioritise patching exposed systems.

When was CVE-2020-11255 published?

CVE-2020-11255 was published on 2021-04-07 and last updated on 2026-06-17.

CVE-2020-11255

CVE-2020-11255 is a high-severity vulnerability in Qualcomm Apq8009 Firmware with a CVSS 3.x base score of 7.5. It is not currently listed as actively exploited by CISA, and its EPSS exploit-prediction score is low. The underlying weakness is classified as CWE-401.

Key facts

Severity: High (CVSS 3.x base score 7.5)
CVSS v2: 7.8
EPSS exploit prediction: 1% (49th percentile)
Actively exploited: Not listed in CISA KEV
Weakness: CWE-401
Affected product: Qualcomm Apq8009 Firmware
Published: 2021-04-07
Last modified: 2026-06-17

Description

Denial of service while processing RTCP packets containing multiple SDES reports due to memory for last SDES packet is freed and rest of the memory is leaked in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Wearables

Frequently asked questions

What is CVE-2020-11255?: Denial of service while processing RTCP packets containing multiple SDES reports due to memory for last SDES packet is freed and rest of the memory is leaked in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Wearables
How severe is CVE-2020-11255?: CVE-2020-11255 has a CVSS 3.x base score of 7.5, rated high severity. It is exploitable over network with low attack complexity, requires no privileges and no user interaction. Impact on confidentiality is none, integrity none, and availability high.
Is CVE-2020-11255 being actively exploited?: It is not currently listed in CISA's KEV catalog. Its EPSS exploit-prediction score is 1% (49th percentile), an estimate of the probability of exploitation in the next 30 days.
What products are affected by CVE-2020-11255?: CVE-2020-11255 primarily affects Qualcomm Apq8009 Firmware. In total, 344 product configurations (CPEs) are listed as vulnerable; see the affected-products list for the exact versions.
How do I fix CVE-2020-11255?: Review the linked vendor and NVD advisories for patched versions and mitigations, then upgrade or apply the recommended workaround. Given its high severity, prioritise patching exposed systems.
When was CVE-2020-11255 published?: CVE-2020-11255 was published on 2021-04-07 and last updated on 2026-06-17.

References

https://www.qualcomm.com/company/product-security/bulletins/april-2021-bulletin

Affected products (344)

cpe:2.3:o:qualcomm:apq8009_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:apq8017_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:apq8037_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:apq8053_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:aqt1000_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:csrb31024_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:mdm8207_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:mdm9205_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:mdm9206_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:mdm9207_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:mdm9250_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:mdm9607_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:mdm9628_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:mdm9640_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:mdm9650_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:mdm9655_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:msm8108_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:msm8208_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:msm8209_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:msm8608_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:msm8917_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:msm8920_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:msm8937_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:msm8940_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:msm8953_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:msm8976_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:msm8976sg_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:msm8996au_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:pm215_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:pm3003a_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:pm4125_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:pm4250_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:pm439_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:pm456_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:pm6125_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:pm6150_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:pm6150a_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:pm6150l_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:pm6250_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:pm640a_firmware:-:*:*:*:*:*:*:*

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