How severe is CVE-2020-11279?

CVE-2020-11279 has a CVSS 3.x base score of 7.5, rated high severity. It is exploitable over network with low attack complexity, requires no privileges and no user interaction. Impact on confidentiality is high, integrity none, and availability none.

Is CVE-2020-11279 being actively exploited?

It is not currently listed in CISA's KEV catalog. Its EPSS exploit-prediction score is 1% (53rd percentile), an estimate of the probability of exploitation in the next 30 days.

What products are affected by CVE-2020-11279?

CVE-2020-11279 primarily affects Qualcomm Apq8009 Firmware. In total, 408 product configurations (CPEs) are listed as vulnerable; see the affected-products list for the exact versions.

How do I fix CVE-2020-11279?

Review the linked vendor and NVD advisories for patched versions and mitigations, then upgrade or apply the recommended workaround. Given its high severity, prioritise patching exposed systems.

When was CVE-2020-11279 published?

CVE-2020-11279 was published on 2021-05-07 and last updated on 2026-06-17.

CVE-2020-11279

CVE-2020-11279 is a high-severity vulnerability in Qualcomm Apq8009 Firmware with a CVSS 3.x base score of 7.5. It is not currently listed as actively exploited by CISA, and its EPSS exploit-prediction score is low. The underlying weakness is classified as CWE-190.

Key facts

Severity: High (CVSS 3.x base score 7.5)
CVSS v2: 10.0
EPSS exploit prediction: 1% (53rd percentile)
Actively exploited: Not listed in CISA KEV
Weakness: CWE-190
Affected product: Qualcomm Apq8009 Firmware
Published: 2021-05-07
Last modified: 2026-06-17

Description

Memory corruption while processing crafted SDES packets due to improper length check in sdes packets recieved in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables

Frequently asked questions

What is CVE-2020-11279?: Memory corruption while processing crafted SDES packets due to improper length check in sdes packets recieved in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables
How severe is CVE-2020-11279?: CVE-2020-11279 has a CVSS 3.x base score of 7.5, rated high severity. It is exploitable over network with low attack complexity, requires no privileges and no user interaction. Impact on confidentiality is high, integrity none, and availability none.
Is CVE-2020-11279 being actively exploited?: It is not currently listed in CISA's KEV catalog. Its EPSS exploit-prediction score is 1% (53rd percentile), an estimate of the probability of exploitation in the next 30 days.
What products are affected by CVE-2020-11279?: CVE-2020-11279 primarily affects Qualcomm Apq8009 Firmware. In total, 408 product configurations (CPEs) are listed as vulnerable; see the affected-products list for the exact versions.
How do I fix CVE-2020-11279?: Review the linked vendor and NVD advisories for patched versions and mitigations, then upgrade or apply the recommended workaround. Given its high severity, prioritise patching exposed systems.
When was CVE-2020-11279 published?: CVE-2020-11279 was published on 2021-05-07 and last updated on 2026-06-17.

References

https://www.qualcomm.com/company/product-security/bulletins/may-2021-bulletin

Affected products (408)

cpe:2.3:o:qualcomm:apq8009_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:apq8009w_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:apq8017_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:apq8037_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:apq8053_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:apq8084_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:apq8096au_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:aqt1000_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:ar6003_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:ar8151_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:csr6030_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:csrb31024_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:mdm8207_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:mdm8215_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:mdm8215m_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:mdm8615m_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:mdm9150_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:mdm9205_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:mdm9206_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:mdm9207_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:mdm9215_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:mdm9230_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:mdm9250_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:mdm9310_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:mdm9330_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:mdm9607_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:mdm9615_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:mdm9615m_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:mdm9625_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:mdm9628_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:mdm9630_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:mdm9635m_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:mdm9640_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:mdm9645_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:mdm9650_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:mdm9655_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:msm8108_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:msm8208_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:msm8209_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:msm8608_firmware:-:*:*:*:*:*:*:*

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