How severe is CVE-2021-30298?

CVE-2021-30298 has a CVSS 3.x base score of 6.7, rated medium severity. It is exploitable over local access with low attack complexity, requires high privileges and no user interaction. Impact on confidentiality is high, integrity high, and availability high.

Is CVE-2021-30298 being actively exploited?

It is not currently listed in CISA's KEV catalog. Its EPSS exploit-prediction score is 0% (4th percentile), an estimate of the probability of exploitation in the next 30 days.

What products are affected by CVE-2021-30298?

CVE-2021-30298 primarily affects Qualcomm Ar8031 Firmware. In total, 61 product configurations (CPEs) are listed as vulnerable; see the affected-products list for the exact versions.

How do I fix CVE-2021-30298?

Review the linked vendor and NVD advisories for patched versions and mitigations, then upgrade or apply the recommended workaround.

When was CVE-2021-30298 published?

CVE-2021-30298 was published on 2022-01-03 and last updated on 2026-06-17.

CVE-2021-30298

CVE-2021-30298 is a medium-severity vulnerability in Qualcomm Ar8031 Firmware with a CVSS 3.x base score of 6.7. It is not currently listed as actively exploited by CISA, and its EPSS exploit-prediction score is low. The underlying weakness is classified as CWE-120.

Key facts

Severity: Medium (CVSS 3.x base score 6.7)
CVSS v2: 4.6
EPSS exploit prediction: 0% (4th percentile)
Actively exploited: Not listed in CISA KEV
Weakness: CWE-120
Affected product: Qualcomm Ar8031 Firmware
Published: 2022-01-03
Last modified: 2026-06-17

Description

Possible out of bound access due to improper validation of item size and DIAG memory pools data while switching between USB and PCIE interface in Snapdragon Auto, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking

Frequently asked questions

What is CVE-2021-30298?: Possible out of bound access due to improper validation of item size and DIAG memory pools data while switching between USB and PCIE interface in Snapdragon Auto, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking
How severe is CVE-2021-30298?: CVE-2021-30298 has a CVSS 3.x base score of 6.7, rated medium severity. It is exploitable over local access with low attack complexity, requires high privileges and no user interaction. Impact on confidentiality is high, integrity high, and availability high.
Is CVE-2021-30298 being actively exploited?: It is not currently listed in CISA's KEV catalog. Its EPSS exploit-prediction score is 0% (4th percentile), an estimate of the probability of exploitation in the next 30 days.
What products are affected by CVE-2021-30298?: CVE-2021-30298 primarily affects Qualcomm Ar8031 Firmware. In total, 61 product configurations (CPEs) are listed as vulnerable; see the affected-products list for the exact versions.
How do I fix CVE-2021-30298?: Review the linked vendor and NVD advisories for patched versions and mitigations, then upgrade or apply the recommended workaround.
When was CVE-2021-30298 published?: CVE-2021-30298 was published on 2022-01-03 and last updated on 2026-06-17.

References

https://www.qualcomm.com/company/product-security/bulletins/december-2021-bulletin

Affected products (61)

cpe:2.3:o:qualcomm:ar8031_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:ar8035_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:csra6620_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:csra6640_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:fsm10055_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:fsm10056_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:ipq8072a_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:ipq8074a_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:ipq8076a_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:mdm9150_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qca6390_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qca6391_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qca6574au_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qca6595au_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qca6696_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qca8337_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qcn9000_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qcn9074_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qcs405_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qcs410_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qcs610_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qrb5165_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qrb5165n_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qualcomm215_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sa8155p_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd205_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd210_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd460_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd662_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd665_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd765_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd765g_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd768g_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd865_5g_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd870_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sda429w_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sdx55_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sdx55m_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sm7250p_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:wcd9335_firmware:-:*:*:*:*:*:*:*

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