How severe is CVE-2021-30309?

CVE-2021-30309 has a CVSS 3.x base score of 7.8, rated high severity. It is exploitable over local access with low attack complexity, requires low privileges and no user interaction. Impact on confidentiality is high, integrity high, and availability high.

Is CVE-2021-30309 being actively exploited?

It is not currently listed in CISA's KEV catalog. Its EPSS exploit-prediction score is 0% (4th percentile), an estimate of the probability of exploitation in the next 30 days.

What products are affected by CVE-2021-30309?

CVE-2021-30309 primarily affects Qualcomm Mdm9650 Firmware. In total, 43 product configurations (CPEs) are listed as vulnerable; see the affected-products list for the exact versions.

How do I fix CVE-2021-30309?

Review the linked vendor and NVD advisories for patched versions and mitigations, then upgrade or apply the recommended workaround. Given its high severity, prioritise patching exposed systems.

When was CVE-2021-30309 published?

CVE-2021-30309 was published on 2022-02-11 and last updated on 2026-06-17.

CVE-2021-30309

CVE-2021-30309 is a high-severity vulnerability in Qualcomm Mdm9650 Firmware with a CVSS 3.x base score of 7.8. It is not currently listed as actively exploited by CISA, and its EPSS exploit-prediction score is low. The underlying weakness is classified as CWE-120.

Key facts

Severity: High (CVSS 3.x base score 7.8)
CVSS v2: 4.6
EPSS exploit prediction: 0% (4th percentile)
Actively exploited: Not listed in CISA KEV
Weakness: CWE-120
Affected product: Qualcomm Mdm9650 Firmware
Published: 2022-02-11
Last modified: 2026-06-17

Description

Improper size validation of QXDM commands can lead to memory corruption in Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile

Frequently asked questions

What is CVE-2021-30309?: Improper size validation of QXDM commands can lead to memory corruption in Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile
How severe is CVE-2021-30309?: CVE-2021-30309 has a CVSS 3.x base score of 7.8, rated high severity. It is exploitable over local access with low attack complexity, requires low privileges and no user interaction. Impact on confidentiality is high, integrity high, and availability high.
Is CVE-2021-30309 being actively exploited?: It is not currently listed in CISA's KEV catalog. Its EPSS exploit-prediction score is 0% (4th percentile), an estimate of the probability of exploitation in the next 30 days.
What products are affected by CVE-2021-30309?: CVE-2021-30309 primarily affects Qualcomm Mdm9650 Firmware. In total, 43 product configurations (CPEs) are listed as vulnerable; see the affected-products list for the exact versions.
How do I fix CVE-2021-30309?: Review the linked vendor and NVD advisories for patched versions and mitigations, then upgrade or apply the recommended workaround. Given its high severity, prioritise patching exposed systems.
When was CVE-2021-30309 published?: CVE-2021-30309 was published on 2022-02-11 and last updated on 2026-06-17.

References

https://www.qualcomm.com/company/product-security/bulletins/february-2022-bulletin

Affected products (43)

cpe:2.3:o:qualcomm:mdm9650_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qca6174a_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qca6390_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qca6391_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qca9377_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qcm6125_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qcs410_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qcs603_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qcs605_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qcs610_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qcs6125_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd660_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd665_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd690_5g_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd730_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd765_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd765g_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd768g_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd865_5g_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd870_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sdx12_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sdx55m_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sdxr1_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sm7250p_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:wcd9326_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:wcd9335_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:wcd9341_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:wcd9370_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:wcd9375_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:wcd9380_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:wcd9385_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:wcn3950_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:wcn3980_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:wcn3988_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:wcn3990_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:wcn3991_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:wcn3998_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:wcn6850_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:wcn6851_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:wsa8810_firmware:-:*:*:*:*:*:*:*

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