How severe is CVE-2021-30331?

CVE-2021-30331 has a CVSS 3.x base score of 5.5, rated medium severity. It is exploitable over local access with low attack complexity, requires low privileges and no user interaction. Impact on confidentiality is high, integrity none, and availability none.

Is CVE-2021-30331 being actively exploited?

It is not currently listed in CISA's KEV catalog. Its EPSS exploit-prediction score is 0% (4th percentile), an estimate of the probability of exploitation in the next 30 days.

What products are affected by CVE-2021-30331?

CVE-2021-30331 primarily affects Qualcomm Ar8035 Firmware. In total, 77 product configurations (CPEs) are listed as vulnerable; see the affected-products list for the exact versions.

How do I fix CVE-2021-30331?

Review the linked vendor and NVD advisories for patched versions and mitigations, then upgrade or apply the recommended workaround.

When was CVE-2021-30331 published?

CVE-2021-30331 was published on 2022-04-01 and last updated on 2026-06-17.

CVE-2021-30331

CVE-2021-30331 is a medium-severity vulnerability in Qualcomm Ar8035 Firmware with a CVSS 3.x base score of 5.5. It is not currently listed as actively exploited by CISA, and its EPSS exploit-prediction score is low. The underlying weakness is classified as CWE-120.

Key facts

Severity: Medium (CVSS 3.x base score 5.5)
CVSS v2: 2.1
EPSS exploit prediction: 0% (4th percentile)
Actively exploited: Not listed in CISA KEV
Weakness: CWE-120
Affected product: Qualcomm Ar8035 Firmware
Published: 2022-04-01
Last modified: 2026-06-17

Description

Possible buffer overflow due to improper data validation of external commands sent via DIAG interface in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables

Frequently asked questions

What is CVE-2021-30331?: Possible buffer overflow due to improper data validation of external commands sent via DIAG interface in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables
How severe is CVE-2021-30331?: CVE-2021-30331 has a CVSS 3.x base score of 5.5, rated medium severity. It is exploitable over local access with low attack complexity, requires low privileges and no user interaction. Impact on confidentiality is high, integrity none, and availability none.
Is CVE-2021-30331 being actively exploited?: It is not currently listed in CISA's KEV catalog. Its EPSS exploit-prediction score is 0% (4th percentile), an estimate of the probability of exploitation in the next 30 days.
What products are affected by CVE-2021-30331?: CVE-2021-30331 primarily affects Qualcomm Ar8035 Firmware. In total, 77 product configurations (CPEs) are listed as vulnerable; see the affected-products list for the exact versions.
How do I fix CVE-2021-30331?: Review the linked vendor and NVD advisories for patched versions and mitigations, then upgrade or apply the recommended workaround.
When was CVE-2021-30331 published?: CVE-2021-30331 was published on 2022-04-01 and last updated on 2026-06-17.

References

https://www.qualcomm.com/company/product-security/bulletins/march-2022-bulletin

Affected products (77)

cpe:2.3:o:qualcomm:ar8035_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:fsm10055_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:fsm10056_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:mdm9150_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:mdm9650_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qca6174a_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qca6390_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qca6391_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qca6426_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qca6436_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qca8081_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qca8337_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qca9377_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qcm2290_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qcm4290_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qcm6125_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qcm6490_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qcs2290_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qcs410_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qcs4290_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qcs610_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qcs6125_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qcs6490_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qcx315_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_675_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_8_gen1_5g_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd460_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd480_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd662_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd665_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd675_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd678_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd690_5g_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd720g_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd730_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd750g_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd765_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd765g_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd768g_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd778g_firmware:-:*:*:*:*:*:*:*

More vulnerabilities in Qualcomm Ar8035 Firmware

CVE-2025-27034 — Critical (CVSS 9.8): Memory corruption while selecting the PLMN from SOR failed list.
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CVE-2024-21473 — Critical (CVSS 9.8): Memory corruption while redirecting log file to any file location with any file name.
CVE-2023-43553 — Critical (CVSS 9.8): Memory corruption while parsing beacon/probe response frame when AP sends more supported links in MLIE.
CVE-2023-43552 — Critical (CVSS 9.8): Memory corruption while processing MBSSID beacon containing several subelement IE.
CVE-2023-28582 — Critical (CVSS 9.8): Memory corruption in Data Modem while verifying hello-verify message during the DTLS handshake.

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