How severe is CVE-2022-22057?

CVE-2022-22057 has a CVSS 3.x base score of 8.4, rated high severity. It is exploitable over local access with low attack complexity, requires no privileges and no user interaction. Impact on confidentiality is high, integrity high, and availability high.

Is CVE-2022-22057 being actively exploited?

It is not currently listed in CISA's KEV catalog. Its EPSS exploit-prediction score is 0% (32nd percentile), an estimate of the probability of exploitation in the next 30 days.

What products are affected by CVE-2022-22057?

CVE-2022-22057 primarily affects Qualcomm Apq8053 Firmware. In total, 80 product configurations (CPEs) are listed as vulnerable; see the affected-products list for the exact versions.

How do I fix CVE-2022-22057?

Review the linked vendor and NVD advisories for patched versions and mitigations, then upgrade or apply the recommended workaround. Given its high severity, prioritise patching exposed systems.

When was CVE-2022-22057 published?

CVE-2022-22057 was published on 2022-06-14 and last updated on 2026-06-17.

CVE-2022-22057

CVE-2022-22057 is a high-severity vulnerability in Qualcomm Apq8053 Firmware with a CVSS 3.x base score of 8.4. It is not currently listed as actively exploited by CISA, and its EPSS exploit-prediction score is low. The underlying weakness is classified as CWE-362.

Key facts

Severity: High (CVSS 3.x base score 8.4)
CVSS v2: 7.2
EPSS exploit prediction: 0% (32nd percentile)
Actively exploited: Not listed in CISA KEV
Weakness: CWE-362
Affected product: Qualcomm Apq8053 Firmware
Published: 2022-06-14
Last modified: 2026-06-17

Description

Use after free in graphics fence due to a race condition while closing fence file descriptor and destroy graphics timeline simultaneously in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables

Frequently asked questions

What is CVE-2022-22057?: Use after free in graphics fence due to a race condition while closing fence file descriptor and destroy graphics timeline simultaneously in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables
How severe is CVE-2022-22057?: CVE-2022-22057 has a CVSS 3.x base score of 8.4, rated high severity. It is exploitable over local access with low attack complexity, requires no privileges and no user interaction. Impact on confidentiality is high, integrity high, and availability high.
Is CVE-2022-22057 being actively exploited?: It is not currently listed in CISA's KEV catalog. Its EPSS exploit-prediction score is 0% (32nd percentile), an estimate of the probability of exploitation in the next 30 days.
What products are affected by CVE-2022-22057?: CVE-2022-22057 primarily affects Qualcomm Apq8053 Firmware. In total, 80 product configurations (CPEs) are listed as vulnerable; see the affected-products list for the exact versions.
How do I fix CVE-2022-22057?: Review the linked vendor and NVD advisories for patched versions and mitigations, then upgrade or apply the recommended workaround. Given its high severity, prioritise patching exposed systems.
When was CVE-2022-22057 published?: CVE-2022-22057 was published on 2022-06-14 and last updated on 2026-06-17.

References

Affected products (80)

cpe:2.3:o:qualcomm:apq8053_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:ar8035_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:msm8953_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qca6174a_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qca6390_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qca6391_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qca6426_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qca6436_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qca6595au_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qca8081_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qca8337_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qca9377_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qcm2290_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qcm4290_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qcm6490_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qcs2290_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qcs4290_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qcs6490_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qrb5165_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qrb5165m_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qrb5165n_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qualcomm215_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sa6155p_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sa8155p_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sa8195p_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_8_gen1_5g_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd439_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd460_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd480_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd662_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd680_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd690_5g_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd695_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd750g_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd765_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd765g_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd768g_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd778g_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd780g_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd865_5g_firmware:-:*:*:*:*:*:*:*

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