CVE-2022-22105
CVE-2022-22105 is a critical-severity vulnerability in Qualcomm Apq8009 Firmware with a CVSS 3.x base score of 9.4. It is not currently listed as actively exploited by CISA, and its EPSS exploit-prediction score is low. The underlying weakness is classified as CWE-190.
Key facts
- Severity: Critical (CVSS 3.x base score 9.4)
- EPSS exploit prediction: 0% (35th percentile)
- Actively exploited: Not listed in CISA KEV
- Weakness: CWE-190
- Affected product: Qualcomm Apq8009 Firmware
- Published:
- Last modified:
Description
Memory corruption in bluetooth due to integer overflow while processing HFP-UNIT profile in Snapdragon Auto, Snapdragon Consumer IOT, Snapdragon Mobile, Snapdragon Voice & Music
Frequently asked questions
- What is CVE-2022-22105?
- Memory corruption in bluetooth due to integer overflow while processing HFP-UNIT profile in Snapdragon Auto, Snapdragon Consumer IOT, Snapdragon Mobile, Snapdragon Voice & Music
- How severe is CVE-2022-22105?
- CVE-2022-22105 has a CVSS 3.x base score of 9.4, rated critical severity. It is exploitable over network with low attack complexity, requires no privileges and no user interaction. Impact on confidentiality is high, integrity high, and availability low.
- Is CVE-2022-22105 being actively exploited?
- It is not currently listed in CISA's KEV catalog. Its EPSS exploit-prediction score is 0% (35th percentile), an estimate of the probability of exploitation in the next 30 days.
- What products are affected by CVE-2022-22105?
- CVE-2022-22105 primarily affects Qualcomm Apq8009 Firmware. In total, 51 product configurations (CPEs) are listed as vulnerable; see the affected-products list for the exact versions.
- How do I fix CVE-2022-22105?
- Review the linked vendor and NVD advisories for patched versions and mitigations, then upgrade or apply the recommended workaround. Given its critical severity, prioritise patching exposed systems.
- When was CVE-2022-22105 published?
- CVE-2022-22105 was published on 2022-09-16 and last updated on 2026-06-17.
References
Affected products (51)
- cpe:2.3:o:qualcomm:apq8009_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:apq8017_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:apq8053_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:apq8096au_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:ar8031_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:csra6620_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:csra6640_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:csrb31024_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:mdm9150_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:mdm9250_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:mdm9607_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:mdm9626_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:mdm9628_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:mdm9640_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:mdm9650_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca4020_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca6174a_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca6564a_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca6564au_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca6574_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca6574a_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca6574au_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca6584_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca6595_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca6595au_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca6696_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca9367_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca9377_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca9379_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qcs405_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa415m_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa515m_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa6155_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa6155p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa8155_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa8155p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa8195p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sdx20_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sdx55_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcd9326_firmware:-:*:*:*:*:*:*:*
More vulnerabilities in Qualcomm Apq8009 Firmware
- CVE-2022-40510 — Critical (CVSS 9.8): Memory corruption due to buffer copy without checking size of input in Audio while voice call with EVS vocoder.
- CVE-2022-22088 — Critical (CVSS 9.8): Memory corruption in Bluetooth HOST due to buffer overflow while parsing the command response received from remote
- CVE-2022-25748 — Critical (CVSS 9.8): Memory corruption in WLAN due to integer overflow to buffer overflow while parsing GTK frames. in Snapdragon Auto,…
- CVE-2022-25720 — Critical (CVSS 9.8): Memory corruption in WLAN due to out of bound array access during connect/roaming in Snapdragon Auto, Snapdragon…
- CVE-2022-25651 — Critical (CVSS 9.8): Memory corruption in bluetooth host due to integer overflow while processing BT HFP-UNIT profile in Snapdragon Auto,…
- CVE-2021-30351 — Critical (CVSS 9.8): An out of bound memory access can occur due to improper validation of number of frames being passed during music…
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