How severe is CVE-2022-25696?

CVE-2022-25696 has a CVSS 3.x base score of 8.4, rated high severity. It is exploitable over local access with low attack complexity, requires no privileges and no user interaction. Impact on confidentiality is high, integrity high, and availability high.

Is CVE-2022-25696 being actively exploited?

It is not currently listed in CISA's KEV catalog. Its EPSS exploit-prediction score is 0% (1st percentile), an estimate of the probability of exploitation in the next 30 days.

What products are affected by CVE-2022-25696?

CVE-2022-25696 primarily affects Qualcomm Apq8053 Firmware. In total, 92 product configurations (CPEs) are listed as vulnerable; see the affected-products list for the exact versions.

How do I fix CVE-2022-25696?

Review the linked vendor and NVD advisories for patched versions and mitigations, then upgrade or apply the recommended workaround. Given its high severity, prioritise patching exposed systems.

When was CVE-2022-25696 published?

CVE-2022-25696 was published on 2022-09-16 and last updated on 2026-06-17.

CVE-2022-25696

CVE-2022-25696 is a high-severity vulnerability in Qualcomm Apq8053 Firmware with a CVSS 3.x base score of 8.4. It is not currently listed as actively exploited by CISA, and its EPSS exploit-prediction score is low. The underlying weakness is classified as CWE-367.

Key facts

Severity: High (CVSS 3.x base score 8.4)
EPSS exploit prediction: 0% (1st percentile)
Actively exploited: Not listed in CISA KEV
Weakness: CWE-367
Affected product: Qualcomm Apq8053 Firmware
Published: 2022-09-16
Last modified: 2026-06-17

Description

Memory corruption in display due to time-of-check time-of-use race condition during map or unmap in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables

Frequently asked questions

What is CVE-2022-25696?: Memory corruption in display due to time-of-check time-of-use race condition during map or unmap in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables
How severe is CVE-2022-25696?: CVE-2022-25696 has a CVSS 3.x base score of 8.4, rated high severity. It is exploitable over local access with low attack complexity, requires no privileges and no user interaction. Impact on confidentiality is high, integrity high, and availability high.
Is CVE-2022-25696 being actively exploited?: It is not currently listed in CISA's KEV catalog. Its EPSS exploit-prediction score is 0% (1st percentile), an estimate of the probability of exploitation in the next 30 days.
What products are affected by CVE-2022-25696?: CVE-2022-25696 primarily affects Qualcomm Apq8053 Firmware. In total, 92 product configurations (CPEs) are listed as vulnerable; see the affected-products list for the exact versions.
How do I fix CVE-2022-25696?: Review the linked vendor and NVD advisories for patched versions and mitigations, then upgrade or apply the recommended workaround. Given its high severity, prioritise patching exposed systems.
When was CVE-2022-25696 published?: CVE-2022-25696 was published on 2022-09-16 and last updated on 2026-06-17.

References

https://www.qualcomm.com/company/product-security/bulletins/september-2022-bulletin

Affected products (92)

cpe:2.3:o:qualcomm:apq8053_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:aqt1000_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:msm8953_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qca6390_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qca6391_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qca6420_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qca6430_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qca6574_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qca6574a_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qca6574au_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qca6595au_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qca6696_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qcm2290_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qcm4290_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qcm6490_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qcs2290_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qcs4290_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qcs6490_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qualcomm215_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sa6155p_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sa8155p_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sa8195p_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_675_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd_8_gen1_5g_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd439_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd460_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd480_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd662_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd665_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd670_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd675_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd678_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd680_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd690_5g_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd695_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd710_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd720g_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd730_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd750g_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd765_firmware:-:*:*:*:*:*:*:*

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