CVE-2023-21624
CVE-2023-21624 is a medium-severity vulnerability in Qualcomm Fastconnect 6700 Firmware with a CVSS 3.x base score of 6.2. It is not currently listed as actively exploited by CISA, and its EPSS exploit-prediction score is low. The underlying weakness is classified as CWE-200.
Key facts
- Severity: Medium (CVSS 3.x base score 6.2)
- EPSS exploit prediction: 0% (2nd percentile)
- Actively exploited: Not listed in CISA KEV
- Weakness: CWE-200
- Affected product: Qualcomm Fastconnect 6700 Firmware
- Published:
- Last modified:
Description
Information disclosure in DSP Services while loading dynamic module.
Frequently asked questions
- What is CVE-2023-21624?
- Information disclosure in DSP Services while loading dynamic module.
- How severe is CVE-2023-21624?
- CVE-2023-21624 has a CVSS 3.x base score of 6.2, rated medium severity. It is exploitable over local access with low attack complexity, requires no privileges and no user interaction. Impact on confidentiality is high, integrity none, and availability none.
- Is CVE-2023-21624 being actively exploited?
- It is not currently listed in CISA's KEV catalog. Its EPSS exploit-prediction score is 0% (2nd percentile), an estimate of the probability of exploitation in the next 30 days.
- What products are affected by CVE-2023-21624?
- CVE-2023-21624 primarily affects Qualcomm Fastconnect 6700 Firmware. In total, 67 product configurations (CPEs) are listed as vulnerable; see the affected-products list for the exact versions.
- How do I fix CVE-2023-21624?
- Review the linked vendor and NVD advisories for patched versions and mitigations, then upgrade or apply the recommended workaround.
- When was CVE-2023-21624 published?
- CVE-2023-21624 was published on 2023-07-04 and last updated on 2026-06-17.
References
Affected products (67)
- cpe:2.3:o:qualcomm:fastconnect_6700_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:fastconnect_6800_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:fastconnect_6900_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qam8255p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca6310_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca6320_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca6391_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca6426_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca6436_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca6574_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca6574a_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca6574au_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca6595au_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca6696_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca6698aq_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca6797aq_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qcs8155_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa6145p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa6150p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa6155_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa6155p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa8145p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa8150p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa8155_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa8155p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa8195p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa8255p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd835_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd865_5g_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd888_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sm7315_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sm7325p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_778g_5g_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_778g\+_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_780g_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_782g_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_7c\+_gen_3_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_835_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_865_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_865\+_firmware:-:*:*:*:*:*:*:*
More vulnerabilities in Qualcomm Fastconnect 6700 Firmware
- CVE-2025-27034 — Critical (CVSS 9.8): Memory corruption while selecting the PLMN from SOR failed list.
- CVE-2025-21483 — Critical (CVSS 9.8): Memory corruption when the UE receives an RTP packet from the network, during the reassembly of NALUs.
- CVE-2024-45569 — Critical (CVSS 9.8): Memory corruption while parsing the ML IE due to invalid frame content.
- CVE-2023-28582 — Critical (CVSS 9.8): Memory corruption in Data Modem while verifying hello-verify message during the DTLS handshake.
- CVE-2023-33025 — Critical (CVSS 9.8): Memory corruption in Data Modem when a non-standard SDP body, during a VOLTE call.
- CVE-2023-22388 — Critical (CVSS 9.8): Memory Corruption in Multi-mode Call Processor while processing bit mask API.
All CVEs affecting Qualcomm Fastconnect 6700 Firmware →
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