CVE-2023-21630
CVE-2023-21630 is a high-severity vulnerability in Qualcomm Qca6391 Firmware with a CVSS 3.x base score of 8.4. It is not currently listed as actively exploited by CISA, and its EPSS exploit-prediction score is low. The underlying weakness is classified as CWE-190.
Key facts
- Severity: High (CVSS 3.x base score 8.4)
- EPSS exploit prediction: 0% (2nd percentile)
- Actively exploited: Not listed in CISA KEV
- Weakness: CWE-190
- Affected product: Qualcomm Qca6391 Firmware
- Published:
- Last modified:
Description
Memory Corruption in Multimedia Framework due to integer overflow when synx bind is called along with synx signal.
Frequently asked questions
- What is CVE-2023-21630?
- Memory Corruption in Multimedia Framework due to integer overflow when synx bind is called along with synx signal.
- How severe is CVE-2023-21630?
- CVE-2023-21630 has a CVSS 3.x base score of 8.4, rated high severity. It is exploitable over local access with low attack complexity, requires no privileges and no user interaction. Impact on confidentiality is high, integrity high, and availability high.
- Is CVE-2023-21630 being actively exploited?
- It is not currently listed in CISA's KEV catalog. Its EPSS exploit-prediction score is 0% (2nd percentile), an estimate of the probability of exploitation in the next 30 days.
- What products are affected by CVE-2023-21630?
- CVE-2023-21630 primarily affects Qualcomm Qca6391 Firmware. In total, 42 product configurations (CPEs) are listed as vulnerable; see the affected-products list for the exact versions.
- How do I fix CVE-2023-21630?
- Review the linked vendor and NVD advisories for patched versions and mitigations, then upgrade or apply the recommended workaround. Given its high severity, prioritise patching exposed systems.
- When was CVE-2023-21630 published?
- CVE-2023-21630 was published on 2023-04-13 and last updated on 2026-06-17.
References
Affected products (42)
- cpe:2.3:o:qualcomm:qca6391_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca6574_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca6574a_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca6574au_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca6595au_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca6696_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa6155p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa8155p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa8195p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd680_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd778g_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd888_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sg4150p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sm6225-ad_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sm7315_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sm7325_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sm7325-ae_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sm7325-af_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sm7325p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sm7350-ab_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sm8350_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sm8350-ac_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sm8450_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sm8475_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sw5100_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sw5100p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcd9370_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcd9375_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcd9380_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcd9385_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcn3950_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcn3980_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcn3988_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcn6740_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcn6750_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcn685x-1_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcn685x-5_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcn785x-1_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcn785x-5_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wsa8810_firmware:-:*:*:*:*:*:*:*
More vulnerabilities in Qualcomm Qca6391 Firmware
- CVE-2025-27034 — Critical (CVSS 9.8): Memory corruption while selecting the PLMN from SOR failed list.
- CVE-2025-21483 — Critical (CVSS 9.8): Memory corruption when the UE receives an RTP packet from the network, during the reassembly of NALUs.
- CVE-2023-43552 — Critical (CVSS 9.8): Memory corruption while processing MBSSID beacon containing several subelement IE.
- CVE-2023-33083 — Critical (CVSS 9.8): Memory corruption in WLAN Host while processing RRM beacon on the AP.
- CVE-2023-33082 — Critical (CVSS 9.8): Memory corruption while sending an Assoc Request having BTM Query or BTM Response containing MBO IE.
- CVE-2023-33045 — Critical (CVSS 9.8): Memory corruption in WLAN Firmware while parsing a NAN management frame carrying a S3 attribute.
All CVEs affecting Qualcomm Qca6391 Firmware →
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