CVE-2023-21640

CVE-2023-21640 is a medium-severity vulnerability in Qualcomm Fastconnect 6900 Firmware with a CVSS 3.x base score of 6.7. It is not currently listed as actively exploited by CISA, and its EPSS exploit-prediction score is low. The underlying weakness is classified as CWE-787.

Key facts

Description

Memory corruption in Linux when the file upload API is called with parameters having large buffer.

Frequently asked questions

What is CVE-2023-21640?
Memory corruption in Linux when the file upload API is called with parameters having large buffer.
How severe is CVE-2023-21640?
CVE-2023-21640 has a CVSS 3.x base score of 6.7, rated medium severity. It is exploitable over local access with low attack complexity, requires high privileges and no user interaction. Impact on confidentiality is high, integrity high, and availability high.
Is CVE-2023-21640 being actively exploited?
It is not currently listed in CISA's KEV catalog. Its EPSS exploit-prediction score is 0% (2nd percentile), an estimate of the probability of exploitation in the next 30 days.
What products are affected by CVE-2023-21640?
CVE-2023-21640 primarily affects Qualcomm Fastconnect 6900 Firmware. In total, 6 product configurations (CPEs) are listed as vulnerable; see the affected-products list for the exact versions.
How do I fix CVE-2023-21640?
Review the linked vendor and NVD advisories for patched versions and mitigations, then upgrade or apply the recommended workaround.
When was CVE-2023-21640 published?
CVE-2023-21640 was published on 2023-07-04 and last updated on 2026-06-17.

References

Affected products (6)

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