CVE-2023-21647

CVE-2023-21647 is a medium-severity vulnerability in Qualcomm Qca6390 Firmware with a CVSS 3.x base score of 6.5. It is not currently listed as actively exploited by CISA, and its EPSS exploit-prediction score is low. The underlying weakness is classified as CWE-20.

Key facts

• Severity: Medium (CVSS 3.x base score 6.5)
• EPSS exploit prediction: 0% (24th percentile)
• Actively exploited: Not listed in CISA KEV
• Weakness: CWE-20
• Affected product: Qualcomm Qca6390 Firmware
• Published: 2023-08-08
• Last modified: 2026-06-17

Description

Information disclosure in Bluetooth when an GATT packet is received due to improper input validation.

Frequently asked questions

What is CVE-2023-21647?

Information disclosure in Bluetooth when an GATT packet is received due to improper input validation.

How severe is CVE-2023-21647?

CVE-2023-21647 has a CVSS 3.x base score of 6.5, rated medium severity. It is exploitable over network with low attack complexity, requires low privileges and no user interaction. Impact on confidentiality is high, integrity none, and availability none.

Is CVE-2023-21647 being actively exploited?

It is not currently listed in CISA's KEV catalog. Its EPSS exploit-prediction score is 0% (24th percentile), an estimate of the probability of exploitation in the next 30 days.

What products are affected by CVE-2023-21647?

CVE-2023-21647 primarily affects Qualcomm Qca6390 Firmware. In total, 43 product configurations (CPEs) are listed as vulnerable; see the affected-products list for the exact versions.

How do I fix CVE-2023-21647?

Review the linked vendor and NVD advisories for patched versions and mitigations, then upgrade or apply the recommended workaround.

When was CVE-2023-21647 published?

CVE-2023-21647 was published on 2023-08-08 and last updated on 2026-06-17.

References

• https://www.qualcomm.com/company/product-security/bulletins/august-2023-bulletin

Affected products (43)

• cpe:2.3:o:qualcomm:qca6390_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:qca6391_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:qca6426_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:qca6436_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:qca6574au_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:qca6595au_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:qca6696_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:qcc5100_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:qcn9074_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:qcs410_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:qcs610_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:sa6145p_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:sa6150p_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:sa6155p_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:sa8145p_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:sa8150p_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:sa8155p_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:sa8195p_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:sd_8_gen1_5g_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:sd865_5g_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:sd870_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:sdx55m_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:sdxr2_5g_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:sw5100_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:sw5100p_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:wcd9341_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:wcd9370_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:wcd9380_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:wcn3660b_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:wcn3680b_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:wcn3950_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:wcn3980_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:wcn3988_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:wcn6850_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:wcn6851_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:wcn6855_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:wcn6856_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:wcn7850_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:wcn7851_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:wsa8810_firmware:-:*:*:*:*:*:*:*

More vulnerabilities in Qualcomm Qca6390 Firmware

• CVE-2023-33045 — Critical (CVSS 9.8): Memory corruption in WLAN Firmware while parsing a NAN management frame carrying a S3 attribute.
• CVE-2023-33028 — Critical (CVSS 9.8): Memory corruption in WLAN Firmware while doing a memory copy of pmk cache.
• CVE-2022-40510 — Critical (CVSS 9.8): Memory corruption due to buffer copy without checking size of input in Audio while voice call with EVS vocoder.
• CVE-2022-33256 — Critical (CVSS 9.8): Memory corruption due to improper validation of array index in Multi-mode call processor.
• CVE-2022-40514 — Critical (CVSS 9.8): Memory corruption due to buffer copy without checking the size of input in WLAN Firmware while processing CCKM IE in…
• CVE-2022-22088 — Critical (CVSS 9.8): Memory corruption in Bluetooth HOST due to buffer overflow while parsing the command response received from remote

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