How severe is CVE-2023-21666?

CVE-2023-21666 has a CVSS 3.x base score of 8.4, rated high severity. It is exploitable over local access with low attack complexity, requires no privileges and no user interaction. Impact on confidentiality is high, integrity high, and availability high.

Is CVE-2023-21666 being actively exploited?

It is not currently listed in CISA's KEV catalog. Its EPSS exploit-prediction score is 0% (8th percentile), an estimate of the probability of exploitation in the next 30 days.

What products are affected by CVE-2023-21666?

CVE-2023-21666 primarily affects Qualcomm Wcn3998 Firmware. In total, 165 product configurations (CPEs) are listed as vulnerable; see the affected-products list for the exact versions.

How do I fix CVE-2023-21666?

Review the linked vendor and NVD advisories for patched versions and mitigations, then upgrade or apply the recommended workaround. Given its high severity, prioritise patching exposed systems.

When was CVE-2023-21666 published?

CVE-2023-21666 was published on 2023-05-02 and last updated on 2026-06-17.

CVE-2023-21666

CVE-2023-21666 is a high-severity vulnerability in Qualcomm Wcn3998 Firmware with a CVSS 3.x base score of 8.4. It is not currently listed as actively exploited by CISA, and its EPSS exploit-prediction score is low. The underlying weakness is classified as CWE-401.

Key facts

Severity: High (CVSS 3.x base score 8.4)
EPSS exploit prediction: 0% (8th percentile)
Actively exploited: Not listed in CISA KEV
Weakness: CWE-401
Affected product: Qualcomm Wcn3998 Firmware
Published: 2023-05-02
Last modified: 2026-06-17

Description

Memory Corruption in Graphics while accessing a buffer allocated through the graphics pool.

Frequently asked questions

What is CVE-2023-21666?: Memory Corruption in Graphics while accessing a buffer allocated through the graphics pool.
How severe is CVE-2023-21666?: CVE-2023-21666 has a CVSS 3.x base score of 8.4, rated high severity. It is exploitable over local access with low attack complexity, requires no privileges and no user interaction. Impact on confidentiality is high, integrity high, and availability high.
Is CVE-2023-21666 being actively exploited?: It is not currently listed in CISA's KEV catalog. Its EPSS exploit-prediction score is 0% (8th percentile), an estimate of the probability of exploitation in the next 30 days.
What products are affected by CVE-2023-21666?: CVE-2023-21666 primarily affects Qualcomm Wcn3998 Firmware. In total, 165 product configurations (CPEs) are listed as vulnerable; see the affected-products list for the exact versions.
How do I fix CVE-2023-21666?: Review the linked vendor and NVD advisories for patched versions and mitigations, then upgrade or apply the recommended workaround. Given its high severity, prioritise patching exposed systems.
When was CVE-2023-21666 published?: CVE-2023-21666 was published on 2023-05-02 and last updated on 2026-06-17.

References

Affected products (165)

cpe:2.3:o:qualcomm:wcn3998_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qca6390_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:wcn685x-5_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:wcn685x-1_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:flight_rb5_5g_platform_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:home_hub_100_platform_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:mdm9250_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:mdm9628_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:mdm9650_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:msm8108_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:msm8209_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:msm8608_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:msm8909w_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qca6174_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qca6174a_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qca6310_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qca6320_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qca6335_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qca6391_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qca6420_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qca6421_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qca6426_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qca6430_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qca6431_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qca6436_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qca6564_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qca6564a_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qca6564au_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qca6574_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qca6574a_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qca6574au_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qca6595_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qca6595au_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qca6696_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qca8337_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qca9367_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qca9377_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qca9379_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qcm2290_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qcm4290_firmware:-:*:*:*:*:*:*:*

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