CVE-2023-21667

CVE-2023-21667 is a medium-severity vulnerability in Qualcomm Qca6390 Firmware with a CVSS 3.x base score of 6.5. It is not currently listed as actively exploited by CISA, and its EPSS exploit-prediction score is low. The underlying weakness is classified as CWE-125.

Key facts

• Severity: Medium (CVSS 3.x base score 6.5)
• EPSS exploit prediction: 0% (23rd percentile)
• Actively exploited: Not listed in CISA KEV
• Weakness: CWE-125
• Affected product: Qualcomm Qca6390 Firmware
• Published: 2023-09-05
• Last modified: 2026-06-17

Description

Transient DOS in Bluetooth HOST while passing descriptor to validate the blacklisted BT keyboard.

Frequently asked questions

What is CVE-2023-21667?

Transient DOS in Bluetooth HOST while passing descriptor to validate the blacklisted BT keyboard.

How severe is CVE-2023-21667?

CVE-2023-21667 has a CVSS 3.x base score of 6.5, rated medium severity. It is exploitable over network with low attack complexity, requires low privileges and no user interaction. Impact on confidentiality is none, integrity none, and availability high.

Is CVE-2023-21667 being actively exploited?

It is not currently listed in CISA's KEV catalog. Its EPSS exploit-prediction score is 0% (23rd percentile), an estimate of the probability of exploitation in the next 30 days.

What products are affected by CVE-2023-21667?

CVE-2023-21667 primarily affects Qualcomm Qca6390 Firmware. In total, 43 product configurations (CPEs) are listed as vulnerable; see the affected-products list for the exact versions.

How do I fix CVE-2023-21667?

Review the linked vendor and NVD advisories for patched versions and mitigations, then upgrade or apply the recommended workaround.

When was CVE-2023-21667 published?

CVE-2023-21667 was published on 2023-09-05 and last updated on 2026-06-17.

References

• https://www.qualcomm.com/company/product-security/bulletins/september-2023-bulletin

Affected products (43)

• cpe:2.3:o:qualcomm:qca6390_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:qca6391_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:qca6426_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:qca6436_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:qca6574au_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:qca6595au_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:qca6696_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:qcc5100_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:qcn9074_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:qcs410_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:qcs610_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:sa6145p_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:sa6150p_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:sa6155p_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:sa8145p_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:sa8150p_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:sa8155p_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:sa8195p_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:sd_8_gen1_5g_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:sd865_5g_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:sd870_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:sdx55m_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:sdxr2_5g_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:sw5100_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:sw5100p_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:wcd9341_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:wcd9370_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:wcd9380_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:wcn3660b_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:wcn3680b_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:wcn3950_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:wcn3980_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:wcn3988_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:wcn6850_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:wcn6851_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:wcn6855_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:wcn6856_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:wcn7850_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:wcn7851_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:wsa8810_firmware:-:*:*:*:*:*:*:*

More vulnerabilities in Qualcomm Qca6390 Firmware

• CVE-2023-33045 — Critical (CVSS 9.8): Memory corruption in WLAN Firmware while parsing a NAN management frame carrying a S3 attribute.
• CVE-2023-33028 — Critical (CVSS 9.8): Memory corruption in WLAN Firmware while doing a memory copy of pmk cache.
• CVE-2022-40510 — Critical (CVSS 9.8): Memory corruption due to buffer copy without checking size of input in Audio while voice call with EVS vocoder.
• CVE-2022-33256 — Critical (CVSS 9.8): Memory corruption due to improper validation of array index in Multi-mode call processor.
• CVE-2022-40514 — Critical (CVSS 9.8): Memory corruption due to buffer copy without checking the size of input in WLAN Firmware while processing CCKM IE in…
• CVE-2022-22088 — Critical (CVSS 9.8): Memory corruption in Bluetooth HOST due to buffer overflow while parsing the command response received from remote

All CVEs affecting Qualcomm Qca6390 Firmware →

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• CVE-2021-21777 — Critical (CVSS 10.0): An information disclosure vulnerability exists in the Ethernet/IP UDP handler functionality of EIP Stack Group OpENer…
• CVE-2017-14451 — Critical (CVSS 10.0): An exploitable out-of-bounds read vulnerability exists in libevm (Ethereum Virtual Machine) of CPP-Ethereum. A…
• CVE-2013-0767 — Critical (CVSS 10.0): The nsSVGPathElement::GetPathLengthScale function in Mozilla Firefox before 18.0, Firefox ESR 10.x before 10.0.12 and…

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