CVE-2023-33074
CVE-2023-33074 is a high-severity vulnerability in Qualcomm Wcn6750 Firmware with a CVSS 3.x base score of 8.4. It is not currently listed as actively exploited by CISA, and its EPSS exploit-prediction score is low. The underlying weakness is classified as CWE-787.
Key facts
- Severity: High (CVSS 3.x base score 8.4)
- EPSS exploit prediction: 0% (4th percentile)
- Actively exploited: Not listed in CISA KEV
- Weakness: CWE-787
- Affected product: Qualcomm Wcn6750 Firmware
- Published:
- Last modified:
Description
Memory corruption in Audio when SSR event is triggered after music playback is stopped.
Frequently asked questions
- What is CVE-2023-33074?
- Memory corruption in Audio when SSR event is triggered after music playback is stopped.
- How severe is CVE-2023-33074?
- CVE-2023-33074 has a CVSS 3.x base score of 8.4, rated high severity. It is exploitable over local access with low attack complexity, requires no privileges and no user interaction. Impact on confidentiality is high, integrity high, and availability high.
- Is CVE-2023-33074 being actively exploited?
- It is not currently listed in CISA's KEV catalog. Its EPSS exploit-prediction score is 0% (4th percentile), an estimate of the probability of exploitation in the next 30 days.
- What products are affected by CVE-2023-33074?
- CVE-2023-33074 primarily affects Qualcomm Wcn6750 Firmware. In total, 60 product configurations (CPEs) are listed as vulnerable; see the affected-products list for the exact versions.
- How do I fix CVE-2023-33074?
- Review the linked vendor and NVD advisories for patched versions and mitigations, then upgrade or apply the recommended workaround. Given its high severity, prioritise patching exposed systems.
- When was CVE-2023-33074 published?
- CVE-2023-33074 was published on 2023-11-07 and last updated on 2026-06-17.
References
Affected products (60)
- cpe:2.3:o:qualcomm:wcn6750_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcn685x-5_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcn685x-1_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcn785x-1_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcn785x-5_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qam8255p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qam8295p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qam8650p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qam8775p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca6574_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca6574a_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca6574au_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca6595_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca6595au_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca6696_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca6698aq_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca6797aq_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qcm4325_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa4150p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa4155p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa6145p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa6150p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa6155p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa8145p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa8150p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa8155p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa8195p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa8255p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa8295p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd865_5g_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sg8275p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sm8550p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sm6225_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sm6225-ad_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_8_gen_2_mobile_platform_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sm8475_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_8\+_gen_2_mobile_platform_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_w5\+_gen_1_wearable_platform_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_xr2_5g_platform_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:ssg2115p_firmware:-:*:*:*:*:*:*:*
More vulnerabilities in Qualcomm Wcn6750 Firmware
- CVE-2023-33028 — Critical (CVSS 9.8): Memory corruption in WLAN Firmware while doing a memory copy of pmk cache.
- CVE-2022-40510 — Critical (CVSS 9.8): Memory corruption due to buffer copy without checking size of input in Audio while voice call with EVS vocoder.
- CVE-2022-33256 — Critical (CVSS 9.8): Memory corruption due to improper validation of array index in Multi-mode call processor.
- CVE-2022-40514 — Critical (CVSS 9.8): Memory corruption due to buffer copy without checking the size of input in WLAN Firmware while processing CCKM IE in…
- CVE-2022-22088 — Critical (CVSS 9.8): Memory corruption in Bluetooth HOST due to buffer overflow while parsing the command response received from remote
- CVE-2022-25748 — Critical (CVSS 9.8): Memory corruption in WLAN due to integer overflow to buffer overflow while parsing GTK frames. in Snapdragon Auto,…
All CVEs affecting Qualcomm Wcn6750 Firmware →
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