CVE-2023-43527
CVE-2023-43527 is a medium-severity vulnerability in Qualcomm Fastconnect 6800 Firmware with a CVSS 3.x base score of 6.8. It is not currently listed as actively exploited by CISA, and its EPSS exploit-prediction score is low. The underlying weakness is classified as CWE-125.
Key facts
- Severity: Medium (CVSS 3.x base score 6.8)
- EPSS exploit prediction: 0% (2nd percentile)
- Actively exploited: Not listed in CISA KEV
- EU (EUVD) id: EUVD-2023-47933
- Weakness: CWE-125
- Affected product: Qualcomm Fastconnect 6800 Firmware
- Published:
- Last modified:
Description
Information disclosure while parsing dts header atom in Video.
Frequently asked questions
- What is CVE-2023-43527?
- Information disclosure while parsing dts header atom in Video.
- How severe is CVE-2023-43527?
- CVE-2023-43527 has a CVSS 3.x base score of 6.8, rated medium severity. It is exploitable over local access with low attack complexity, requires no privileges and no user interaction. Impact on confidentiality is high, integrity none, and availability low.
- Is CVE-2023-43527 being actively exploited?
- It is not currently listed in CISA's KEV catalog. Its EPSS exploit-prediction score is 0% (2nd percentile), an estimate of the probability of exploitation in the next 30 days.
- What products are affected by CVE-2023-43527?
- CVE-2023-43527 primarily affects Qualcomm Fastconnect 6800 Firmware. In total, 54 product configurations (CPEs) are listed as vulnerable; see the affected-products list for the exact versions.
- How do I fix CVE-2023-43527?
- Review the linked vendor and NVD advisories for patched versions and mitigations, then upgrade or apply the recommended workaround.
- Does CVE-2023-43527 have an EU (EUVD) identifier?
- Yes. CVE-2023-43527 is tracked in the ENISA EU Vulnerability Database (EUVD) as EUVD-2023-47933.
- When was CVE-2023-43527 published?
- CVE-2023-43527 was published on 2024-05-06 and last updated on 2026-06-17.
References
Affected products (54)
- cpe:2.3:o:qualcomm:fastconnect_6800_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:fastconnect_6900_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:fastconnect_7800_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qam8295p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca6391_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca6426_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca6436_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca6574au_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca6696_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qcn9074_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qcs410_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qcs610_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:video_collaboration_vc1_platform_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:video_collaboration_vc3_platform_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa6145p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa6150p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa6155p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa8145p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa8150p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa8155p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa8195p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa8295p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd660_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd865_5g_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sdm429w_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_429_mobile_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_660_mobile_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_8_gen_1_mobile_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_865_5g_mobile_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_865\+_5g_mobile_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_870_5g_mobile_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_w5\+_gen_1_wearable_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_wear_4100\+_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_x55_5g_modem-rf_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_xr2_5g_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sw5100_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sw5100p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sxr2130_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcd9335_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcd9341_firmware:-:*:*:*:*:*:*:*
More vulnerabilities in Qualcomm Fastconnect 6800 Firmware
- CVE-2025-27034 — Critical (CVSS 9.8): Memory corruption while selecting the PLMN from SOR failed list.
- CVE-2025-21483 — Critical (CVSS 9.8): Memory corruption when the UE receives an RTP packet from the network, during the reassembly of NALUs.
- CVE-2023-22388 — Critical (CVSS 9.8): Memory Corruption in Multi-mode Call Processor while processing bit mask API.
- CVE-2023-28581 — Critical (CVSS 9.8): Memory corruption in WLAN Firmware while parsing receieved GTK Keys in GTK KDE.
- CVE-2023-28562 — Critical (CVSS 9.8): Memory corruption while handling payloads from remote ESL.
- CVE-2023-43538 — Critical (CVSS 9.3): Memory corruption in TZ Secure OS while Tunnel Invoke Manager initialization.
All CVEs affecting Qualcomm Fastconnect 6800 Firmware →
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