CVE-2024-21467
CVE-2024-21467 is a medium-severity vulnerability in Qualcomm Wsa8835 Firmware with a CVSS 3.x base score of 6.5. It is not currently listed as actively exploited by CISA, and its EPSS exploit-prediction score is low. The underlying weakness is classified as CWE-125.
Key facts
- Severity: Medium (CVSS 3.x base score 6.5)
- EPSS exploit prediction: 0% (18th percentile)
- Actively exploited: Not listed in CISA KEV
- EU (EUVD) id: EUVD-2024-19176
- Weakness: CWE-125
- Affected product: Qualcomm Wsa8835 Firmware
- Published:
- Last modified:
Description
Information disclosure while handling beacon probe frame during scan entry generation in client side.
Frequently asked questions
- What is CVE-2024-21467?
- Information disclosure while handling beacon probe frame during scan entry generation in client side.
- How severe is CVE-2024-21467?
- CVE-2024-21467 has a CVSS 3.x base score of 6.5, rated medium severity. It is exploitable over network with low attack complexity, requires no privileges and no user interaction. Impact on confidentiality is low, integrity none, and availability low.
- Is CVE-2024-21467 being actively exploited?
- It is not currently listed in CISA's KEV catalog. Its EPSS exploit-prediction score is 0% (18th percentile), an estimate of the probability of exploitation in the next 30 days.
- What products are affected by CVE-2024-21467?
- CVE-2024-21467 primarily affects Qualcomm Wsa8835 Firmware. In total, 129 product configurations (CPEs) are listed as vulnerable; see the affected-products list for the exact versions.
- How do I fix CVE-2024-21467?
- Review the linked vendor and NVD advisories for patched versions and mitigations, then upgrade or apply the recommended workaround.
- Does CVE-2024-21467 have an EU (EUVD) identifier?
- Yes. CVE-2024-21467 is tracked in the ENISA EU Vulnerability Database (EUVD) as EUVD-2024-19176.
- When was CVE-2024-21467 published?
- CVE-2024-21467 was published on 2024-08-05 and last updated on 2026-06-17.
References
Affected products (129)
- cpe:2.3:o:qualcomm:wsa8835_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wsa8830_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wsa8815_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wsa8810_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcn3988_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcn3980_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcd9385_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcd9380_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sw5100p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sw5100_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:srv1m_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:srv1h_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_x65_5g_modem-rf_system_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_x55_5g_modem-rf_system_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_w5\+_gen_1_wearable_platform_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_auto_5g_modem-rf_gen_2_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_870_5g_mobile_platform_\(sm8250-ac\)_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_865\+_5g_mobile_platform_\(sm8250-ab\)_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_865_5g_mobile_platform_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sdx65m_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sdx55_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa9000p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa8775p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa8770p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa8650p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa8620p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa8255p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa8195p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa8155p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa7775p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa7255p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa6155p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa4155p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa4150p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qcn9274_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qcn9100_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qcn9074_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qcn9072_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qcn9070_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qcn9024_firmware:-:*:*:*:*:*:*:*
More vulnerabilities in Qualcomm Wsa8835 Firmware
- CVE-2025-27034 — Critical (CVSS 9.8): Memory corruption while selecting the PLMN from SOR failed list.
- CVE-2025-21483 — Critical (CVSS 9.8): Memory corruption when the UE receives an RTP packet from the network, during the reassembly of NALUs.
- CVE-2024-45569 — Critical (CVSS 9.8): Memory corruption while parsing the ML IE due to invalid frame content.
- CVE-2023-43553 — Critical (CVSS 9.8): Memory corruption while parsing beacon/probe response frame when AP sends more supported links in MLIE.
- CVE-2023-43552 — Critical (CVSS 9.8): Memory corruption while processing MBSSID beacon containing several subelement IE.
- CVE-2023-28582 — Critical (CVSS 9.8): Memory corruption in Data Modem while verifying hello-verify message during the DTLS handshake.
All CVEs affecting Qualcomm Wsa8835 Firmware →
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