CVE-2024-33016
CVE-2024-33016 is a medium-severity vulnerability in Qualcomm Qcn9000 Firmware with a CVSS 3.x base score of 6.8. It is not currently listed as actively exploited by CISA, and its EPSS exploit-prediction score is low. The underlying weakness is classified as CWE-119.
Key facts
- Severity: Medium (CVSS 3.x base score 6.8)
- EPSS exploit prediction: 0% (5th percentile)
- Actively exploited: Not listed in CISA KEV
- EU (EUVD) id: EUVD-2024-30761
- Weakness: CWE-119
- Affected product: Qualcomm Qcn9000 Firmware
- Published:
- Last modified:
Description
memory corruption when an invalid firehose patch command is invoked.
Frequently asked questions
- What is CVE-2024-33016?
- memory corruption when an invalid firehose patch command is invoked.
- How severe is CVE-2024-33016?
- CVE-2024-33016 has a CVSS 3.x base score of 6.8, rated medium severity. It is exploitable over physical access with low attack complexity, requires no privileges and no user interaction. Impact on confidentiality is high, integrity high, and availability high.
- Is CVE-2024-33016 being actively exploited?
- It is not currently listed in CISA's KEV catalog. Its EPSS exploit-prediction score is 0% (5th percentile), an estimate of the probability of exploitation in the next 30 days.
- What products are affected by CVE-2024-33016?
- CVE-2024-33016 primarily affects Qualcomm Qcn9000 Firmware. In total, 333 product configurations (CPEs) are listed as vulnerable; see the affected-products list for the exact versions.
- How do I fix CVE-2024-33016?
- Review the linked vendor and NVD advisories for patched versions and mitigations, then upgrade or apply the recommended workaround.
- Does CVE-2024-33016 have an EU (EUVD) identifier?
- Yes. CVE-2024-33016 is tracked in the ENISA EU Vulnerability Database (EUVD) as EUVD-2024-30761.
- When was CVE-2024-33016 published?
- CVE-2024-33016 was published on 2024-09-02 and last updated on 2026-06-17.
References
Affected products (333)
- cpe:2.3:o:qualcomm:qcn9000_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qcn9011_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qcn9012_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qcn9013_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qcn9022_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qcn9024_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qcn9070_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qcn9072_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qcn9074_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qcn9160_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qcn9274_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qcs2290_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qcs410_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qcs4290_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qcs4490_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qcs5430_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qcs610_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qcs6125_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qcs6490_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qcs7230_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qcs8155_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_855_mobile_platform_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_855\+\/860_mobile_platform_\(sm8150-ac\)_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_865_5g_mobile_platform_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_865\+_5g_mobile_platform_\(sm8250-ab\)_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_870_5g_mobile_platform_\(sm8250-ac\)_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_888_5g_mobile_platform_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_888\+_5g_mobile_platform_\(sm8350-ac\)_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_8c_compute_platform_\(sc8180x-ad\)_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_8c_compute_platform_\(sc8180xp-ad\)_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_8cx_compute_platform_\(sc8180x-aa\)_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_8cx_compute_platform_\(sc8180x-ab\)_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_8cx_compute_platform_\(sc8180xp-ac\)_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qcn7606_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qcn6432_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qcn6422_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qcn6412_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qcn6402_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qcn6274_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qcn6224_firmware:-:*:*:*:*:*:*:*
More vulnerabilities in Qualcomm Qcn9000 Firmware
- CVE-2024-45569 — Critical (CVSS 9.8): Memory corruption while parsing the ML IE due to invalid frame content.
- CVE-2024-33066 — Critical (CVSS 9.8): Memory corruption while redirecting log file to any file location with any file name.
- CVE-2024-21473 — Critical (CVSS 9.8): Memory corruption while redirecting log file to any file location with any file name.
- CVE-2023-43553 — Critical (CVSS 9.8): Memory corruption while parsing beacon/probe response frame when AP sends more supported links in MLIE.
- CVE-2023-43552 — Critical (CVSS 9.8): Memory corruption while processing MBSSID beacon containing several subelement IE.
- CVE-2023-33083 — Critical (CVSS 9.8): Memory corruption in WLAN Host while processing RRM beacon on the AP.
All CVEs affecting Qualcomm Qcn9000 Firmware →
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