CVE-2024-38397
CVE-2024-38397 is a high-severity vulnerability in Qualcomm Snapdragon 8+ Gen 2 Mobile Platform Firmware with a CVSS 3.x base score of 7.5. It is not currently listed as actively exploited by CISA, and its EPSS exploit-prediction score is low. The underlying weakness is classified as CWE-125.
Key facts
- Severity: High (CVSS 3.x base score 7.5)
- EPSS exploit prediction: 0% (23rd percentile)
- Actively exploited: Not listed in CISA KEV
- EU (EUVD) id: EUVD-2024-37301
- Weakness: CWE-125
- Affected product: Qualcomm Snapdragon 8+ Gen 2 Mobile Platform Firmware
- Published:
- Last modified:
Description
Transient DOS while parsing probe response and assoc response frame.
Frequently asked questions
- What is CVE-2024-38397?
- Transient DOS while parsing probe response and assoc response frame.
- How severe is CVE-2024-38397?
- CVE-2024-38397 has a CVSS 3.x base score of 7.5, rated high severity. It is exploitable over network with low attack complexity, requires no privileges and no user interaction. Impact on confidentiality is none, integrity none, and availability high.
- Is CVE-2024-38397 being actively exploited?
- It is not currently listed in CISA's KEV catalog. Its EPSS exploit-prediction score is 0% (23rd percentile), an estimate of the probability of exploitation in the next 30 days.
- What products are affected by CVE-2024-38397?
- CVE-2024-38397 primarily affects Qualcomm Snapdragon 8+ Gen 2 Mobile Platform Firmware. In total, 116 product configurations (CPEs) are listed as vulnerable; see the affected-products list for the exact versions.
- How do I fix CVE-2024-38397?
- Review the linked vendor and NVD advisories for patched versions and mitigations, then upgrade or apply the recommended workaround. Given its high severity, prioritise patching exposed systems.
- Does CVE-2024-38397 have an EU (EUVD) identifier?
- Yes. CVE-2024-38397 is tracked in the ENISA EU Vulnerability Database (EUVD) as EUVD-2024-37301.
- When was CVE-2024-38397 published?
- CVE-2024-38397 was published on 2024-10-07 and last updated on 2026-06-17.
References
Affected products (116)
- cpe:2.3:o:qualcomm:snapdragon_8\+_gen_2_mobile_platform_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wsa8845h_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wsa8845_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wsa8840_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wsa8835_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wsa8832_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wsa8830_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcd9395_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcd9390_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcd9385_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcd9380_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcd9375_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcd9370_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcd9340_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sxr2250p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sxr2230p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sxr1230p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:ssg2125p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:ssg2115p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:srv1m_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:srv1l_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:srv1h_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_x75_5g_modem-rf_system_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_x72_5g_modem-rf_system_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_x65_5g_modem-rf_system_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_auto_5g_modem-rf_gen_2_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_ar2_gen_1_platform_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_8_gen_3_mobile_platform_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_8_gen_2_mobile_platform_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sm8550p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sg8275p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sdx65m_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa9000p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa8775p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa8770p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa8650p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa8620p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa8295p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa8255p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa8195p_firmware:-:*:*:*:*:*:*:*
More vulnerabilities in Qualcomm Snapdragon 8+ Gen 2 Mobile Platform Firmware
- CVE-2025-27034 — Critical (CVSS 9.8): Memory corruption while selecting the PLMN from SOR failed list.
- CVE-2025-21483 — Critical (CVSS 9.8): Memory corruption when the UE receives an RTP packet from the network, during the reassembly of NALUs.
- CVE-2023-33045 — Critical (CVSS 9.8): Memory corruption in WLAN Firmware while parsing a NAN management frame carrying a S3 attribute.
- CVE-2023-22388 — Critical (CVSS 9.8): Memory Corruption in Multi-mode Call Processor while processing bit mask API.
- CVE-2023-33028 — Critical (CVSS 9.8): Memory corruption in WLAN Firmware while doing a memory copy of pmk cache.
- CVE-2023-24855 — Critical (CVSS 9.8): Memory corruption in Modem while processing security related configuration before AS Security Exchange.
All CVEs affecting Qualcomm Snapdragon 8+ Gen 2 Mobile Platform Firmware →
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