CVE-2024-38418
CVE-2024-38418 is a high-severity vulnerability in Qualcomm C-v2x 9150 Firmware with a CVSS 3.x base score of 7.8. It is not currently listed as actively exploited by CISA, and its EPSS exploit-prediction score is low. The underlying weakness is classified as CWE-367.
Key facts
- Severity: High (CVSS 3.x base score 7.8)
- EPSS exploit prediction: 0% (1st percentile)
- Actively exploited: Not listed in CISA KEV
- EU (EUVD) id: EUVD-2024-37113
- Weakness: CWE-367
- Affected product: Qualcomm C-v2x 9150 Firmware
- Published:
- Last modified:
Description
Memory corruption while parsing the memory map info in IOCTL calls.
Frequently asked questions
- What is CVE-2024-38418?
- Memory corruption while parsing the memory map info in IOCTL calls.
- How severe is CVE-2024-38418?
- CVE-2024-38418 has a CVSS 3.x base score of 7.8, rated high severity. It is exploitable over local access with low attack complexity, requires low privileges and no user interaction. Impact on confidentiality is high, integrity high, and availability high.
- Is CVE-2024-38418 being actively exploited?
- It is not currently listed in CISA's KEV catalog. Its EPSS exploit-prediction score is 0% (1st percentile), an estimate of the probability of exploitation in the next 30 days.
- What products are affected by CVE-2024-38418?
- CVE-2024-38418 primarily affects Qualcomm C-v2x 9150 Firmware. In total, 62 product configurations (CPEs) are listed as vulnerable; see the affected-products list for the exact versions.
- How do I fix CVE-2024-38418?
- Review the linked vendor and NVD advisories for patched versions and mitigations, then upgrade or apply the recommended workaround. Given its high severity, prioritise patching exposed systems.
- Does CVE-2024-38418 have an EU (EUVD) identifier?
- Yes. CVE-2024-38418 is tracked in the ENISA EU Vulnerability Database (EUVD) as EUVD-2024-37113.
- When was CVE-2024-38418 published?
- CVE-2024-38418 was published on 2025-02-03 and last updated on 2026-06-17.
References
Affected products (62)
- cpe:2.3:o:qualcomm:c-v2x_9150_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:csrb31024_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:fastconnect_6800_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:fastconnect_6900_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:fastconnect_7800_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qam8295p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca6391_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca6426_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca6436_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca6564au_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca6574au_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca6595au_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca6696_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qcn9074_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qcs410_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qcs610_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qsm8250_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:video_collaboration_vc1_platform_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:video_collaboration_vc3_platform_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa6145p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa6150p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa6155p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa8145p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa8150p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa8155p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa8195p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa8295p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa8530p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa8540p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa9000p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd865_5g_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sdm429w_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sdx55_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_429_mobile_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_8_gen_1_mobile_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_865_5g_mobile_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_865\+_5g_mobile_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_870_5g_mobile_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_w5\+_gen_1_wearable_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_x55_5g_modem-rf_firmware:-:*:*:*:*:*:*:*
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- CVE-2023-33030 — Critical (CVSS 9.3): Memory corruption in HLOS while running playready use-case.
- CVE-2022-33231 — Critical (CVSS 9.3): Memory corruption due to double free in core while initializing the encryption key.
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