How severe is CVE-2024-43047?

CVE-2024-43047 has a CVSS 3.x base score of 7.8, rated high severity. It is exploitable over local access with low attack complexity, requires low privileges and no user interaction. Impact on confidentiality is high, integrity high, and availability high.

Is CVE-2024-43047 being actively exploited?

Yes. CVE-2024-43047 is on CISA's Known Exploited Vulnerabilities (KEV) catalog, added on 2024-10-08, which means active exploitation has been confirmed. It should be prioritised for remediation.

What products are affected by CVE-2024-43047?

CVE-2024-43047 primarily affects Qualcomm Fastconnect 6700 Firmware. In total, 64 product configurations (CPEs) are listed as vulnerable; see the affected-products list for the exact versions.

How do I fix CVE-2024-43047?

Review the linked vendor and NVD advisories for patched versions and mitigations, then upgrade or apply the recommended workaround. Because this CVE is known to be actively exploited, treat remediation as urgent — CISA KEV typically sets a short remediation deadline.

Does CVE-2024-43047 have an EU (EUVD) identifier?

Yes. CVE-2024-43047 is tracked in the ENISA EU Vulnerability Database (EUVD) as EUVD-2024-40024. It is also flagged as exploited in the EUVD (since 2024-10-08).

When was CVE-2024-43047 published?

CVE-2024-43047 was published on 2024-10-07 and last updated on 2026-06-17.

CVE-2024-43047

CVE-2024-43047 is a high-severity vulnerability in Qualcomm Fastconnect 6700 Firmware with a CVSS 3.x base score of 7.8. It is listed in CISA's Known Exploited Vulnerabilities (KEV) catalog, confirming it has been exploited in the wild (added 2024-10-08). The underlying weakness is classified as CWE-416.

Key facts

Severity: High (CVSS 3.x base score 7.8)
EPSS exploit prediction: 1% (48th percentile)
Actively exploited: Yes — listed in CISA KEV (added 2024-10-08)
EU (EUVD) id: EUVD-2024-40024
EU exploitation: Flagged exploited in the ENISA EU Vulnerability Database (since 2024-10-08)
Weakness: CWE-416
Affected product: Qualcomm Fastconnect 6700 Firmware
Published: 2024-10-07
Last modified: 2026-06-17

Description

Memory corruption while maintaining memory maps of HLOS memory.

Frequently asked questions

What is CVE-2024-43047?: Memory corruption while maintaining memory maps of HLOS memory.
How severe is CVE-2024-43047?: CVE-2024-43047 has a CVSS 3.x base score of 7.8, rated high severity. It is exploitable over local access with low attack complexity, requires low privileges and no user interaction. Impact on confidentiality is high, integrity high, and availability high.
Is CVE-2024-43047 being actively exploited?: Yes. CVE-2024-43047 is on CISA's Known Exploited Vulnerabilities (KEV) catalog, added on 2024-10-08, which means active exploitation has been confirmed. It should be prioritised for remediation.
What products are affected by CVE-2024-43047?: CVE-2024-43047 primarily affects Qualcomm Fastconnect 6700 Firmware. In total, 64 product configurations (CPEs) are listed as vulnerable; see the affected-products list for the exact versions.
How do I fix CVE-2024-43047?: Review the linked vendor and NVD advisories for patched versions and mitigations, then upgrade or apply the recommended workaround. Because this CVE is known to be actively exploited, treat remediation as urgent — CISA KEV typically sets a short remediation deadline.
Does CVE-2024-43047 have an EU (EUVD) identifier?: Yes. CVE-2024-43047 is tracked in the ENISA EU Vulnerability Database (EUVD) as EUVD-2024-40024. It is also flagged as exploited in the EUVD (since 2024-10-08).
When was CVE-2024-43047 published?: CVE-2024-43047 was published on 2024-10-07 and last updated on 2026-06-17.

References

Affected products (64)

cpe:2.3:o:qualcomm:fastconnect_6700_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:fastconnect_6800_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:fastconnect_6900_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:fastconnect_7800_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qam8295p_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qca6174a_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qca6391_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qca6426_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qca6436_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qca6574au_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qca6584au_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qca6595_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qca6595au_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qca6688aq_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qca6696_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qca6698aq_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qcs410_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qcs610_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:qcs6490_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:video_collaboration_vc1_platform_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:video_collaboration_vc3_platform_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sa4150p_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sa4155p_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sa6145p_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sa6150p_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sa6155p_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sa8145p_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sa8150p_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sa8155p_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sa8195p_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sa8295p_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd660_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sd865_5g_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sg4150p_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:snapdragon_660_mobile_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:snapdragon_680_4g_mobile_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:snapdragon_685_4g_mobile_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:snapdragon_8_gen_1_mobile_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:snapdragon_865_5g_mobile_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:snapdragon_865\+_5g_mobile_firmware:-:*:*:*:*:*:*:*

More vulnerabilities in Qualcomm Fastconnect 6700 Firmware

CVE-2025-27034 — Critical (CVSS 9.8): Memory corruption while selecting the PLMN from SOR failed list.
CVE-2025-21483 — Critical (CVSS 9.8): Memory corruption when the UE receives an RTP packet from the network, during the reassembly of NALUs.
CVE-2024-45569 — Critical (CVSS 9.8): Memory corruption while parsing the ML IE due to invalid frame content.
CVE-2023-28582 — Critical (CVSS 9.8): Memory corruption in Data Modem while verifying hello-verify message during the DTLS handshake.
CVE-2023-33025 — Critical (CVSS 9.8): Memory corruption in Data Modem when a non-standard SDP body, during a VOLTE call.
CVE-2023-22388 — Critical (CVSS 9.8): Memory Corruption in Multi-mode Call Processor while processing bit mask API.

All CVEs affecting Qualcomm Fastconnect 6700 Firmware →

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